The present invention provides means capable of achieving both a reduction in the number of defects and a reduction in haze in an object to be polished after polishing at a high level in a method of polishing the object to be polished containing a material having a silicon-silicon bond. The present invention relates to a method of polishing an object to be polished containing a material having a silicon-silicon bond, and the polishing method includes a final polishing step P f . In this polishing method, the final polishing step P f has a plurality of polishing sub-steps, the plurality of polishing sub-steps are continuously performed on the same polishing platen, a final polishing sub-step in the plurality of polishing sub-steps is a polishing sub-step P ff of polishing using a polishing composition S ff , a polishing sub-step provided before the polishing sub-step P ff in the plurality of polishing sub-steps is a polishing sub-step P fp of polishing using a polishing composition S fp , and the polishing composition S ff satisfies at least one of the following condition (A) or the following condition (B): condition (A): a value of a haze parameter of the polishing composition S ff obtained in a standard test 1 is smaller than a value of the haze parameter of the polishing composition S fp obtained in the standard test 1, and condition (B): the polishing composition S ff contains an abrasive A ff , a basic compound B ff , and hydroxyethyl cellulose.