A cooling device including: a resin flow path (10) which is provided with a space portion (10A) serving as a flow path in at least one surface; a metal cooling panel (20) for cooling a heating element, which covers the space portion (10A) and of which at least a part is in contact with the resin flow path (10) ; and a resin bonding member (30) for bonding the resin flow path (10) and the metal cooling panel (20), in which the metal cooling panel (20) has a fine uneven structure at least on a surface of a bonding portion with the resin bonding member (30), and the metal cooling panel (20) and the resin bonding member (30) are bonded by allowing a part of the resin bonding member (30) to enter into the fine uneven structure.