公开(公告)号：EP4167347A1

公开(公告)日：2023-04-19

申请号：EP21825767.3

申请日：2021-06-08

申请人： Mitsui Chemicals, Inc.

发明人： KURIYAGAWA, Mizue ,  KIMURA, Kazuki

IPC分类号： H01M10/613 ,  H01M10/625 ,  H01M10/6554 ,  F28D15/02 ,  H01M50/342

摘要： A metal-resin complex, comprising a space surrounded by a metal component and a resin component, the resin component comprising at least one fragile portion.

公开(公告)号：EP3835054A1

公开(公告)日：2021-06-16

申请号：EP19847399.3

申请日：2019-08-07

申请人： Mitsui Chemicals, Inc.

发明人： TOMINAGA, Takahiro ,  KIMURA, Kazuki

IPC分类号： B32B15/08 ,  B29C45/14

摘要： A composite structure includes: a metal member; and a thermoplastic resin member bonded to the metal member, in which the metal member has a fine uneven structure at least on a metal surface to which the thermoplastic resin member is bonded, a hardness of the thermoplastic resin member measured by a type A durometer in accordance with JIS K6253 is in a range of equal to or more than A60 and equal to or less than A95, and an acid value of the thermoplastic resin member is equal to or more than 1 mgKOH/g and equal to or less than 100 mgKOH/g.
The thermoplastic resin member preferably contains a urethane-based thermoplastic elastomer, an amide-based thermoplastic elastomer, and an acid-modified polyolefin.

公开(公告)号：EP4099343A1

公开(公告)日：2022-12-07

申请号：EP21747321.4

申请日：2021-01-29

申请人： Mitsui Chemicals, Inc.

发明人： KIMURA, Kazuki ,  TORII, Tomoki ,  TOMINAGA, Takahiro ,  MORIMOTO, Kai ,  NAKAJIMA, Shinji ,  WASHIO, Isao ,  SHIMBORI, Nobuyoshi ,  SHIMAZAKI, Junya ,  ZHANG, Jingjun ,  AMANO, Akinori ,  DOI, Haruka

IPC分类号： H01B7/00 ,  H01B13/00 ,  H01M50/50 ,  H02K3/30 ,  H02K3/38 ,  H02K3/50

摘要： A member for electric conduction, comprising a metal member and a resin member that is joined to at least a part of a surface of the metal member, the metal member having a roughness index, which is obtained by dividing a true surface area (m 2 ) measured by a krypton adsorption method by a geometric surface area (m 2 ), of 4.0 or more.

公开(公告)号：EP3979316A1

公开(公告)日：2022-04-06

申请号：EP20812696.1

申请日：2020-05-15

申请人： Mitsui Chemicals, Inc.

发明人： TOMINAGA, Takahiro ,  KIMURA, Kazuki

IPC分类号： H01L23/473 ,  H05K7/20

摘要： A cooling device, satisfying at least one of following (1) or (2): (1) comprising a casing and a flow channel that is disposed inside the casing, the casing comprising a metal portion and a resin portion that is bonded to at least a portion of the metal portion. (2) comprising a casing that comprises a metal, a flow channel that is disposed inside the casing, and a component that comprises a resin and is bonded to a surface of the casing.

公开(公告)号：EP4183547A1

公开(公告)日：2023-05-24

申请号：EP21843075.9

申请日：2021-07-13

申请人： Mitsui Chemicals, Inc.

发明人： TOMINAGA, Takahiro ,  KIMURA, Kazuki

IPC分类号： B29C45/14 ,  H01L23/473 ,  H01M10/613 ,  H01M10/625 ,  H01M10/6556 ,  H01M10/6568 ,  F16J15/06 ,  H05K7/20

摘要： A heat exchange device includes a heat exchange main body portion, a joint member, and a resin sealing portion. The heat exchange main body portion has an internal flow path through which a heat exchange medium flows, and a metal wall portion including a through-hole communicating with the internal flow path. The joint member has a protruding portion and a hollow portion. The protruding portion includes an opening through which the heat exchange medium is supplied or discharged. The protruding portion protrudes toward an outside of the heat exchange main body portion through the through-hole. The hollow portion is formed for causing the opening and the internal flow path to communicate with each other. The resin sealing portion seals a gap between an inner peripheral surface of the through-hole and an outer peripheral surface of the protruding portion.

公开(公告)号：EP3960325A1

公开(公告)日：2022-03-02

申请号：EP20794658.3

申请日：2020-04-21

申请人： Mitsui Chemicals, Inc.

发明人： TOMINAGA, Takahiro ,  MORIMOTO, Kai ,  KIMURA, Kazuki ,  MAKIGUCHI, Wataru ,  UEDA, Kosuke

IPC分类号： B21D47/04 ,  B21D53/00 ,  B29C45/14 ,  H05K5/02

摘要： Provided is an electronic device housing including a metal member and a plastic antenna cover that are joined and integrated by insert molding. In this electronic device housing, the plastic antenna cover is a molded product of a thermoplastic resin composition containing a thermoplastic polyester resin having a melting point Tm equal to or higher than 250°C.

公开(公告)号：EP3760410A1

公开(公告)日：2021-01-06

申请号：EP19757621.8

申请日：2019-02-26

申请人： Mitsui Chemicals, Inc.

发明人： TOMINAGA, Takahiro ,  KIMURA, Kazuki ,  MISUMI, Masaki ,  SHINBORI, Nobuyoshi

IPC分类号： B29C45/14 ,  H05K5/02 ,  H05K5/04

摘要： A dissimilar material joint including a joined portion between a resin rib and a metal base, in which the metal base forms a protrusion protruding inside of the resin rib on at least a part of the joined portion.

公开(公告)号：EP2853370A1

公开(公告)日：2015-04-01

申请号：EP13793127.5

申请日：2013-03-15

申请人： Mitsui Chemicals, Inc.

发明人： OKUMURA, Hiroshi ,  UCHIDA, Kiminori ,  KIMURA, Kazuki ,  INOUE, Goro ,  ISAKI, Takeharu

IPC分类号： B29C45/14 ,  B32B15/085 ,  B29K23/00

CPC分类号： B29C45/14311 ,  B29C45/14778 ,  B29K2023/06 ,  B29K2023/08 ,  B29K2023/12 ,  B29K2105/0085 ,  B29K2705/00 ,  B32B3/266 ,  B32B3/30 ,  B32B15/085 ,  B32B15/18 ,  B32B15/20 ,  B32B27/08 ,  B32B27/20 ,  B32B27/32 ,  B32B2250/03 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2262/106 ,  B32B2264/102 ,  B32B2264/104 ,  B32B2307/542 ,  B32B2509/10 ,  B32B2605/00 ,  Y10T428/24545 ,  Y10T428/265

摘要： In a complex (106) of the invention, a resin member (105) made of a resin material including a polyolefin and a metal member (103) are joined together through a primer layer (104). In addition, the resin member (105) is obtained by molding the resin material by injection, a coexistence layer in which a primer resin material configuring the primer layer (104) and the resin material coexist is formed between the primer layer (104) and the resin member (105), and a thickness of the coexistence layer is in a range of more than or equal to 5 nm and less than or equal to 50 nm.

摘要翻译： 在本发明的复合体（106）中，由包含聚烯烃和金属构件（103）的树脂材料制成的树脂构件（105）通过底漆层（104）接合在一起。 另外，通过注射成型树脂材料来获得树脂部件（105），在底漆层（104）和底漆层（104）之间形成共面层，其中构成底漆层（104）的底漆树脂材料和树脂材料共存 树脂部件（105）和共存层的厚度在5nm以上且小于等于50nm的范围内。

公开(公告)号：EP4040931A1

公开(公告)日：2022-08-10

申请号：EP20871345.3

申请日：2020-09-30

申请人： Mitsui Chemicals, Inc.

发明人： KIMURA, Kazuki ,  KURIYAGAWA, Mizue ,  TORII, Tomoki ,  OKUMURA, Yasuyuki ,  TOBA, Norihide ,  NAKATA, Takashi

IPC分类号： H05K7/20 ,  H01M10/613 ,  H01M10/615 ,  H01M10/625 ,  H01M10/6554 ,  H01M10/6556 ,  H01M10/6563 ,  H01M10/6568 ,  H01M50/20

摘要： A heating element accommodation case, comprising a casing to accommodate a heating element, the casing having a flow channel configured for a liquid to flow through, a portion of the flow channel being formed of a resin; and a heating element accommodation case, comprising a casing to accommodate a heating element and an airflow channel configured for air to flow through.

公开(公告)号：EP3989331A1

公开(公告)日：2022-04-27

申请号：EP20825876.4

申请日：2020-06-12

申请人： Mitsui Chemicals, Inc.

发明人： KIMURA, Kazuki ,  TOMINAGA, Takahiro ,  KURIYAGAWA, Mizue ,  TORII, Tomoki ,  NOMOTO, Kyohei

IPC分类号： H01M10/613 ,  H01M10/625 ,  H01M10/6554 ,  H01M10/6568 ,  H05K7/20

摘要： A cooling device including: a resin flow path (10) which is provided with a space portion (10A) serving as a flow path in at least one surface; a metal cooling panel (20) for cooling a heating element, which covers the space portion (10A) and of which at least a part is in contact with the resin flow path (10) ; and a resin bonding member (30) for bonding the resin flow path (10) and the metal cooling panel (20), in which the metal cooling panel (20) has a fine uneven structure at least on a surface of a bonding portion with the resin bonding member (30), and the metal cooling panel (20) and the resin bonding member (30) are bonded by allowing a part of the resin bonding member (30) to enter into the fine uneven structure.