发明公开
- 专利标题: SOLID-STATE IMAGING APPARATUS
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申请号: EP20833490.4申请日: 2020-06-26
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公开(公告)号: EP3993040A1公开(公告)日: 2022-05-04
- 发明人: NAKAZAWA, Keiichi , ZAITSU, Koichiro , FUJII, Nobutoshi , HIURA, Yohei , MORI, Shigetaka , OKAMOTO, Shintaro , OHSHIMA, Keiji , MANDA, Shuji , YAMAMOTO, Junpei , YUGA, Yui , MIYAKE, Shinichi , KAMBE, Tomoki , OGATA, Ryo , MIYAJI, Tatsuki , NAKAGAWA, Shinji , YAMASHITA, Hirofumi , HAMAMOTO, Yasushi , KIMIZUKA, Naohiko
- 申请人: Sony Semiconductor Solutions Corporation
- 申请人地址: JP Atsugi-shi, Kanagawa 243-0014 4-14-1, Asahi-cho
- 代理机构: MFG Patentanwälte Meyer-Wildhagen Meggle-Freund Gerhard PartG mbB
- 优先权: JP2019118222 20190626
- 国际公布: WO2020262643 20201230
- 主分类号: H01L27/146
- IPC分类号: H01L27/146
摘要:
There is provided a solid-state imaging device including: a first semiconductor layer including a photoelectric converter and an electric charge accumulation section for each pixel, the electric charge accumulation section in which a signal electric charge generated in the photoelectric converter is accumulated; a pixel separation section that is provided in the first semiconductor layer, and partitions a plurality of the pixels from each other; a second semiconductor layer that is provided with a pixel transistor and is stacked on the first semiconductor layer, the pixel transistor that reads the signal electric charge of the electric charge accumulation section; and a first shared coupling section that is provided between the second semiconductor layer and the first semiconductor layer, and is provided to straddle the pixel separation section and is electrically coupled to a plurality of the electric charge accumulation sections.
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