- 专利标题: ROOM TEMPERATURE CURABLE RESIN COMPOSITION, COATING AGENT, ADHESIVE, SEALING AGENT, AND ARTICLE
-
申请号: EP20858305.4申请日: 2020-08-20
-
公开(公告)号: EP4023722A1公开(公告)日: 2022-07-06
- 发明人: KATAYAMA Taiki , YAMADA Tetsuro , HIROKAMI Munenao
- 申请人: Shin-Etsu Chemical Co., Ltd.
- 申请人地址: JP Tokyo 100-0005 4-1, Marunouchi 1-chome Chiyoda-ku
- 代理机构: Mewburn Ellis LLP
- 优先权: JP2019155261 20190828
- 国际公布: WO2021039555 20210304
- 主分类号: C08L101/10
- IPC分类号: C08L101/10 ; C08K3/013 ; C08K5/544 ; C09D7/48 ; C09D7/63 ; C09D201/10 ; C09J11/06 ; C09J201/10 ; C09K3/10
摘要:
The present invention is a room temperature curable resin composition comprising: as the main agent, an organic polymer in which both molecular chain terminals are sealed by a silanol group and/or a hydrolyzable silyl group; and an organic silicon compound of a specific structure having, in a molecule, an organosiloxane structure, a hydrolyzable silyl group, and a hindered amine skeleton. This resin composition produces a cured product in which the degradation over time associated with the effects of light such as UV rays can be suppressed.
信息查询