公开(公告)号：EP4484500A1

公开(公告)日：2025-01-01

申请号：EP23759668.9

申请日：2023-02-07

Applicant: Kaneka Corporation

Inventor： OGAWA, Akira ,  SAKABE, Masaomi ,  YANO, Ayako

IPC: C08L101/10 ,  C08K3/26 ,  C08K3/34 ,  C08K5/5435 ,  C08L91/00 ,  C09J11/04 ,  C09J11/06 ,  C09J171/02 ,  C09J201/10

Abstract: The object is to provide, without use of an epoxy resin, a curable composition which has good workability and which has excellent adhesiveness even after an alkaline treatment. The object is attained by providing a curable composition containing: (A) 100 parts by weight of an organic polymer having a hydrolyzable silyl group; (B) 3 parts by weight to 35 parts by weight of at least one type of process oil selected from the group consisting of paraffinic process oils, naphthenic process oils, and aromatic process oils; (C) 20 parts by weight to 200 parts by weight of silica sand; and (D) 2 parts by weight to 10 parts by weight of a silane compound having an epoxy group and/or a silane compound having an amino group.

公开(公告)号：EP4458911A1

公开(公告)日：2024-11-06

申请号：EP22915898.5

申请日：2022-12-22

Applicant: SHIN-ETSU CHEMICAL CO., LTD.

Inventor： UTA Akira

IPC: C08L101/10 ,  C08K3/013 ,  C08K5/05 ,  C08K5/098 ,  C08K5/31 ,  C08K5/5425 ,  C08K5/56 ,  C08L71/02 ,  C09D7/63 ,  C09D201/10 ,  C09J11/06 ,  C09J201/10 ,  C09K3/10

Abstract: A room-temperature-curing resin composition, which contains in specific ratios
(A) an organic polymer in which molecular chain ends are capped by hydrolyzable silyl groups and/or hydroxysilyl groups and
(B) a hydrolyzable organosilane compound represented in general formula (1) below and/or a partially hydrolyzed condensate thereof

(where R 1 is a monovalent hydrocarbon group having a carbon number of 1-10, n is 1-8, and m is 3 or 4),
has equivalent or superior curing properties compared to conventional alcohol-release or oxime-release room-temperature-curing resin compositions even if various catalysts are used, can reduce harmful effects on humans and environmental load, and can provide a cured rubber product after curing having favorable rubber properties, adhesion, and durability.

公开(公告)号：EP4419602A1

公开(公告)日：2024-08-28

申请号：EP22808638.5

申请日：2022-10-18

Applicant: Kleiberit SE & Co. KG

Inventor： BECKER-WEIMANN, Klaus ,  FRANK, Patrick ,  WUNDERLICH, Steffen

IPC: C08L101/10 ,  C09J171/02 ,  C09J201/10

CPC classification number: C09J171/02 ,  C08G65/336

公开(公告)号：EP4367195A1

公开(公告)日：2024-05-15

申请号：EP22754114.1

申请日：2022-07-06

Applicant: Bostik SA

Inventor： MAMERI, Foudil ,  LALOUCH, Lahoussaine ,  BORDAT, Jean-Marie

IPC: C09J201/10 ,  C09J7/38 ,  C08G65/336 ,  C08K9/06 ,  C09J171/02 ,  C09J175/08 ,  C08K3/36 ,  C09J7/25 ,  C09J143/04 ,  C08K5/549

CPC classification number: C09J201/10 ,  C08K3/36 ,  C09J175/08 ,  C09J5/06 ,  C09J175/04 ,  C09J175/06 ,  C08K9/08 ,  C08K2201/00620130101

公开(公告)号：EP3741786B1

公开(公告)日：2024-04-10

申请号：EP19175648.5

申请日：2019-05-21

Inventor： LÜNNE, Mario

IPC: C08G59/22 ,  C08F4/40 ,  C08G59/24 ,  C08G59/68 ,  C08K3/36 ,  C08K5/541 ,  C08K9/06 ,  C08L43/04 ,  C08L101/10 ,  C09J143/04 ,  C09J201/10

公开(公告)号：EP4326794A1

公开(公告)日：2024-02-28

申请号：EP22722268.4

申请日：2022-04-12

Applicant: Sika Technology AG

Inventor： MENNECKE, Klaas ,  SUTER, Riccardo

IPC: C08G18/10 ,  C08G18/48 ,  C08G18/75 ,  C09J201/10 ,  C09J175/00

公开(公告)号：EP4291597A1

公开(公告)日：2023-12-20

申请号：EP22703851.0

申请日：2022-02-03

Applicant: Strongbond B.V.

Inventor： BLOCK, DE, Rudolph Frank ,  HEES, VAN, Ilse Adriënne ,  DA CRUZ DE AZEVEDO, Gabriela

IPC: C08G65/336 ,  C09J171/00 ,  C09J201/10 ,  C09J175/04

公开(公告)号：EP3997165B1

公开(公告)日：2023-09-06

申请号：EP20739359.6

申请日：2020-07-10

Inventor： DESRATS, Jean-Yves ,  DI RISIO, Antonio ,  KANOUNI, Mouhcine ,  BATTISTI, Andrea ,  GRASSINI, David

IPC: C08K5/134 ,  C08K5/20 ,  C08K5/00 ,  C09J201/10

公开(公告)号：EP4185652A1

公开(公告)日：2023-05-31

申请号：EP21755533.3

申请日：2021-07-19

Applicant: Bostik SA

Inventor： GARNIER, Claire

IPC: C09J201/10 ,  C08L29/10 ,  C08G18/83 ,  C09J7/38 ,  C09J175/06 ,  C09J175/08 ,  C08G18/28 ,  C08G65/336 ,  A61L15/58 ,  C09J171/02 ,  C08L101/10 ,  C09J143/04

公开(公告)号：EP3222690B8

公开(公告)日：2022-03-30

申请号：EP17161553.7

申请日：2017-03-17

Inventor： HIPPOLD, Theodor Hugo

IPC: C09J123/08 ,  C09J175/06 ,  C09J201/10 ,  C08L23/08