A device for forming a housing for a power semiconductor module arrangement comprises a mold (80). The mold (80) comprises a first cavity (812) comprising a plurality of first openings (822) and a second opening (824), the second opening being coupled to a runner system (814), wherein the runner system (814) is configured to inject a mold material (90) into the first cavity (812) through the second opening (824). The device further comprises a plurality of sleeves or hollow bushings (82), wherein a first end (92) of each of the plurality of sleeves or hollow bushings (82) is arranged in one of the first openings (822), and wherein a second end of each of the plurality of sleeves or hollow bushings (82) extends to the outside of the mold (80), a heating element (84) configured to heat the mold (80), and a cooling element (86) configured to cool the plurality of sleeves or hollow bushings (82).