- 专利标题： CONTROLLED METHOD FOR DEPOSITING A CHROMIUM OR CHROMIUM ALLOY LAYER ON AT LEAST ONE SUBSTRATE
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申请号： EP22173932.9申请日： 2018-04-04
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公开(公告)号： EP4071280A1公开(公告)日： 2022-10-12
- 发明人: Walter, Anke , Yevtushenko, Oleksandra , Paulig, Franziska
- 申请人： Atotech Deutschland GmbH & Co. KG
- 申请人地址： DE 10553 Berlin Erasmusstraße 20
- 代理机构： Atotech Deutschland GmbH & Co. KG
- 优先权： EP17164733 20170404
- 主分类号： C25D3/06
- IPC分类号： C25D3/06 ; C25D21/14 ; C25D5/00 ; C25D5/12
摘要：
The present invention refers to a controlled method for depositing a chromium or chromium alloy layer on at least one substrate, the method comprising the steps
(a) providing an aqueous deposition bath, wherein
the bath comprises
- trivalent chromium ions,
- bromide ions,
- alkali metal cations in a total amount of 0 mol/L to 1 mol/L, based on the total volume of the deposition bath, and
the bath has
- a target pH within the range from 4.1 to 7.0,
(b) providing the at least one substrate and at least one anode,
(c) immersing the at least one substrate in the aqueous deposition bath and applying an electrical direct current such that the chromium or chromium alloy layer is deposited on the substrate, the substrate being the cathode, wherein during or after step (c) the pH of the deposition bath is lower than the target pH,
(d) adding NH 4 OH and/or NH 3 during or after step (c) to the deposition bath such that the target pH of the deposition bath is recovered.
(a) providing an aqueous deposition bath, wherein
the bath comprises
- trivalent chromium ions,
- bromide ions,
- alkali metal cations in a total amount of 0 mol/L to 1 mol/L, based on the total volume of the deposition bath, and
the bath has
- a target pH within the range from 4.1 to 7.0,
(b) providing the at least one substrate and at least one anode,
(c) immersing the at least one substrate in the aqueous deposition bath and applying an electrical direct current such that the chromium or chromium alloy layer is deposited on the substrate, the substrate being the cathode, wherein during or after step (c) the pH of the deposition bath is lower than the target pH,
(d) adding NH 4 OH and/or NH 3 during or after step (c) to the deposition bath such that the target pH of the deposition bath is recovered.
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