Embodiments of this application disclose a dielectric filter and a communication device. The dielectric filter includes: a first dielectric block and a second dielectric block that are stacked up, where a first surface of the first dielectric block is opposite to a second surface of the second dielectric block; a first blind hole, a first through hole, and two or more resonance through holes whose openings are located on the first surface of the first dielectric block, and a second through hole whose opening is located on the second surface of the second dielectric block. A metal layer on the first surface of the first dielectric block is connected to a metal layer on the second surface of the second dielectric block. A metal layer on an inner wall of the first through hole is connected to the metal layer on the first surface of the first dielectric block. A metal layer on an inner wall of the first blind hole is connected to the metal layer on the first surface of the first dielectric block. A metal layer on an inner wall of the second through hole is connected to the metal layer on the second surface of the second dielectric block. This dielectric filter implements miniaturization and improves radio frequency performance of the dielectric filter.