The present invention provides a heat dissipation sheet, which is prepared by molding a thermally conductive resin composition prepared by blending an inorganic filler component and a resin component, the inorganic filler component including a first inorganic filler and a second inorganic filler, provided that particle size distribution of the inorganic filler component includes a first maximum point M1 attributable to the first inorganic filler and a second maximum point M2 attributable to the second inorganic filler; the particle size at the first maximum point M1 is 15 pm or more; the particle size at the second maximum point M2 is 2/3 or less the particle size at the first maximum point M1; and an accumulated amount of the frequency between the peak start PS and the peak end PE of the peak having the first maximum point M1 is 50% or more, and which has a surface roughness of from 1.5 to 3.0 pm and a thickness of 0.2 mm or less. According to the present invention, a thin heat dissipation sheet having excellent thermal conductance can be provided.