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公开(公告)号：EP4105173A1
公开(公告)日：2022-12-21
申请号：EP21770425.3
申请日：2021-03-18
发明人： WADA, Kosuke , TANIGUCHI, Yoshitaka
IPC分类号： C01B21/06 , C01B21/064 , H01L23/36 , H01L23/373 , C08L83/05 , C08L83/07 , C08K3/013 , H05K7/20
摘要： Provided is a heat dissipation sheet containing a silicone resin and a thermally conductive filler, wherein, in a cross-sectional view in the thickness direction from one surface to the other surface of the heat radiation sheet, with respect to the cross-sectional shape of the thermally conductive filler, the average value of an aspect ratio of the 1st to 24th particles from the largest of biaxial average diameters, is in a range of 0.4 or more and 1.4 or less. As a result, it is possible to provide a heat dissipation sheet which exhibits excellent thermal conductivity and insulating property even under high pressure, and a method for producing the heat dissipation sheet. In addition, with respect to the 1st to 24th particles from the largest of biaxial average diameters, an area ratio (Sr) of a total area S of cross-sectional shapes of a plurality of the particles to a whole area of the cross-sectional view may be in a range of 20% or more and 80% or less, and the particle number ratio may be less than 1, preferably 0.4 or more and less than 1. Further, the heat dissipation sheet may have a thermal resistance ratio R 0.4 /R 1.0 of 1 or more, wherein R 0.4 is a thermal resistance value when a pressure of 0.4 MPa is applied in the thickness direction and R 1.0 is a thermal resistance value when a pressure of 1.0 MPa is applied in the thickness direction.
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公开(公告)号：EP4149226A1
公开(公告)日：2023-03-15
申请号：EP21821334.6
申请日：2021-06-11
IPC分类号： H05K7/20 , C04B35/583 , C09K5/14
摘要： The present invention provides a heat dissipation sheet, which is prepared by molding a thermally conductive resin composition prepared by blending an inorganic filler component and a resin component, the inorganic filler component including a first inorganic filler and a second inorganic filler, provided that particle size distribution of the inorganic filler component includes a first maximum point M1 attributable to the first inorganic filler and a second maximum point M2 attributable to the second inorganic filler; the particle size at the first maximum point M1 is 15 pm or more; the particle size at the second maximum point M2 is 2/3 or less the particle size at the first maximum point M1; and an accumulated amount of the frequency between the peak start PS and the peak end PE of the peak having the first maximum point M1 is 50% or more, and which has a surface roughness of from 1.5 to 3.0 pm and a thickness of 0.2 mm or less. According to the present invention, a thin heat dissipation sheet having excellent thermal conductance can be provided.
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公开(公告)号：EP4148091A1
公开(公告)日：2023-03-15
申请号：EP21821028.4
申请日：2021-06-11
IPC分类号： C08L101/00 , C09K5/14 , C08K3/38
摘要： The present invention provides a heat-conductive resin composition containing an inorganic filler component and a resin component, wherein the inorganic filler component includes a first inorganic filler and a second inorganic filler, a particle size distribution of the inorganic filler component has a first maximum point caused by the first inorganic filler and a second maximum point caused by the second inorganic filler, a particle diameter at the first maximum point is 15 pm or more, a particle diameter at the second maximum point is 2/3 or less of the particle diameter at the first maximum point, an integrated amount of frequency between a peak start and a peak end in a peak having the first maximum point is 50% or more, and the first inorganic filler is formed by agglomerating hexagonal boron nitride primary particles and has a crushing strength of 6 MPa or more. The heat dissipation sheet of the present invention is obtained by molding the heat-conductive resin composition of the present invention. According to the present invention, it is possible to provide a heat-conductive resin composition having excellent thermal conductivity suitable for producing a thin molded body and a heat dissipation sheet formed by molding the heat-conductive resin composition.
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4.发明公开
公开(公告)号：EP3530614A1
公开(公告)日：2019-08-28
申请号：EP17863255.0
申请日：2017-08-31
发明人： TAKEDA, Go , TANIGUCHI, Yoshitaka , OGUMA, Takemi
IPC分类号： C01B21/064 , C08K9/06 , C08L101/00
摘要： The present invention provides a spherical boron nitride fine powder and the other superior in filling property into resin. The present invention relates to a spherical boron nitride fine powder having the following characteristics (A) to (C):
(A) the spherical boron nitride fine particles have any one or more of Si, Ti, Zr, Ce, Al, Mg, Ge, Ga, and V in an amount of 0.1 atm % or more and 3.0 atm % or less in its composition on the surface of 10 nm;
(B) the spherical boron nitride fine powder has an average particle diameter of 0.05 µm or more and 1 µm or less; and
(C) the spherical boron nitride fine powder has an average circularity of 0.8 or more.-
5.发明公开
公开(公告)号：EP3524573A1
公开(公告)日：2019-08-14
申请号：EP17858116.1
申请日：2017-08-31
发明人： TAKEDA, Go , TANIGUCHI, Yoshitaka
IPC分类号： C01B21/064 , C08K3/38 , C08L101/00
摘要： The main purpose of the present invention is to provide a boron nitride powder having excellent conductivity and high grain strength. A boron nitride powder, comprising boron nitride aggregated grains that are formed by aggregation of scaly hexagonal boron nitride primary particles, the boron nitride powder having the following characteristic properties (A) to (C): (A) the primary particles of the scaly hexagonal boron nitride have an average long side length of 1.5 µm or more and 3.5 µm or less and a standard deviation of 1.2 µm or less; (B) the boron nitride aggregated grains have a grain strength of 8.0 MPa or more at a cumulative breakdown rate of 63.2% and a grain strength of 4.5 MPa or more at a cumulative breakdown rate of 20.0%; and (C) the boron nitride powder has an average particle diameter of 20 µm or more and 100 µm or less. Also provided are a method for producing the same and a thermally conductive resin composition comprising the same.
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