- 专利标题: MICRO LED PACKAGE AND DISPLAY MODULE COMPRISING SAME
-
申请号: EP21861879.1申请日: 2021-07-14
-
公开(公告)号: EP4156266A1公开(公告)日: 2023-03-29
- 发明人: LEE, Hyungjin , KANG, Jinhee
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Gyeonggi-do 16677 129, Samsung-ro Yeongtong-gu Suwon-si
- 代理机构: Appleyard Lees IP LLP
- 优先权: KR20200109637 20200828
- 国际公布: WO2022045580 20220303
- 主分类号: H01L25/13
- IPC分类号: H01L25/13 ; H01L25/075 ; H01L23/31 ; H01L23/528 ; H01L33/48
摘要:
A light-emitting diode package and a display module comprising same are disclosed. The light-emitting diode package comprises: a transparent layer; a plurality of light-emitting diodes disposed on one side of the transparent layer at uniform intervals with a light-emitting surface facing the transparent layer; a spacer formed on one side of the transparent layer and having a larger height than the height up to an electrode pad of the plurality of light-emitting diodes on the basis of one side of the transparent layer; and a protective member covering the plurality of light-emitting diodes.
信息查询
IPC分类: