公开(公告)号：EP4156266A1

公开(公告)日：2023-03-29

申请号：EP21861879.1

申请日：2021-07-14

申请人： Samsung Electronics Co., Ltd.

发明人： LEE, Hyungjin ,  KANG, Jinhee

IPC分类号： H01L25/13 ,  H01L25/075 ,  H01L23/31 ,  H01L23/528 ,  H01L33/48

摘要： A light-emitting diode package and a display module comprising same are disclosed. The light-emitting diode package comprises: a transparent layer; a plurality of light-emitting diodes disposed on one side of the transparent layer at uniform intervals with a light-emitting surface facing the transparent layer; a spacer formed on one side of the transparent layer and having a larger height than the height up to an electrode pad of the plurality of light-emitting diodes on the basis of one side of the transparent layer; and a protective member covering the plurality of light-emitting diodes.

公开(公告)号：EP3891723A1

公开(公告)日：2021-10-13

申请号：EP20774054.9

申请日：2020-03-19

申请人： Samsung Electronics Co., Ltd.

发明人： JUNG, Youngki ,  KANG, Jinhee ,  KIM, Jinho ,  SHIN, Sangmin ,  JUNG, Chulgyu

IPC分类号： G09G3/32 ,  G09G3/00 ,  H01L27/15

公开(公告)号：EP3770963A1

公开(公告)日：2021-01-27

申请号：EP20176932.0

申请日：2020-05-27

申请人： Samsung Electronics Co., Ltd.

发明人： KANG, Jinhee ,  PARK, Taesoon ,  JUNG, Youngki ,  JUNG, Chulgyu

IPC分类号： H01L25/075 ,  H01L33/62 ,  H01L33/52

摘要： A display module and a manufacturing method thereof is provided. The display module may include a substrate; a thin film transistor (TFT) layer disposed on a surface of the substrate; a plurality of LED packages including a connection substrate and a plurality of LEDs disposed on a first surface of the connection substrate; and a wiring configured to electrically connect the TFT layer and the plurality of LEDs. The wiring includes a first wiring for electrically coupling with the plurality of LEDs on the first surface, and a second wiring for electrically coupling with the TFT layer on a second surface of the connection substrate.