- 专利标题: HYDROGENATED COPOLYMER, RESIN COMPOSITION, MOLDED BODY AND ADHESIVE FILM
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申请号: EP21828414.9申请日: 2021-06-08
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公开(公告)号: EP4169959A1公开(公告)日: 2023-04-26
- 发明人: HATTORI, Goki , KUSANOSE, Yasuhiro , ICHINO, Hiroyuki
- 申请人: Asahi Kasei Kabushiki Kaisha
- 申请人地址: JP Tokyo 1000006 1-1-2 Yurakucho Chiyoda-ku
- 代理机构: Strehl Schübel-Hopf & Partner
- 优先权: JP2020107264 20200622
- 国际公布: WO2021261241 20211230
- 主分类号: C08F297/04
- IPC分类号: C08F297/04 ; C08L53/02 ; C09J7/30
摘要:
Provided is a hydrogenated copolymer (X) comprising: a hydrogenated copolymer (A); and a hydrogenated copolymer (B), wherein the hydrogenated copolymer (X) satisfies the following (1) to (4): (1): the hydrogenated copolymer (A) has a random copolymer structure comprising a conjugated diene monomer unit and a vinyl aromatic monomer unit, and a content of the vinyl aromatic monomer unit in (A) is 10 to 80 mass%; (2): the hydrogenated copolymer (B) has a random copolymer structure comprising a conjugated diene monomer unit and a vinyl aromatic monomer unit, and a content of the vinyl aromatic monomer unit in (B) is 10 to 80 mass%; (3): a ratio (Mn1/Mn2) of (Mn1) of the hydrogenated copolymer (A) to (Mn2) of the hydrogenated copolymer (B) is less than 0.25, and 1000 ≤ Mn1 ≤ 40000; and (4): a mass ratio (A)/(B) of a content of the hydrogenated copolymer (A) to a content of the hydrogenated copolymer (B) is 5/95 to 50/50.
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