发明公开
- 专利标题: MULTI-DIMENSIONAL MEMORY CLUSTER
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申请号: EP22183261.1申请日: 2022-07-06
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公开(公告)号: EP4174661A1公开(公告)日: 2023-05-03
- 发明人: CHOI, Byung Hee
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Gyeonggi-do, 16677 129, Samsung-ro Yeongtong-gu, Suwon-si
- 代理机构: Kuhnen & Wacker Patent- und Rechtsanwaltsbüro PartG mbB
- 优先权: US202117553393 20211216
- 主分类号: G06F12/02
- IPC分类号: G06F12/02 ; G06F3/06 ; H04L45/00 ; H04L45/28 ; H04L45/302
摘要:
A system, which may be a multi-dimensional memory cluster, is provided. In some embodiments, the system includes a first node (205), having an external port for making a connection to a host (207); a second node (205), connected to the first node (205) by a first memory-centric connection; the second node (205) storing a service level descriptor; the first node (205) being configured to: receive, from the host (207), a first request (825), addressed to the second node (205), for the service level descriptor; and forward the first request (825) to the second node (205), the second node (205) being configured to: receive the first request (825); and send a first response, to the first node (205), the first response including the service level descriptor of the second node.
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