• 专利标题: CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
  • 申请号: EP22859566.6
    申请日: 2022-08-22
  • 公开(公告)号: EP4192214A1
    公开(公告)日: 2023-06-07
  • 发明人: GUO, JianqiangLUO, WenjunLI, Jun
  • 申请人: Honor Device Co., Ltd.
  • 申请人地址: CN Shenzhen, Guangdong 518040 Suite 3401, Unit A, Building 6 Shum Yip Sky Park, No. 8089 Hongli West Road Xiangmihu Street Futian District
  • 代理机构: Gill Jennings & Every LLP
  • 优先权: CN202111162855 20210930
  • 国际公布: WO2023051091 20230406
  • 主分类号: H05K9/00
  • IPC分类号: H05K9/00
CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
摘要:
Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes: a first circuit board and a second circuit board stacked with the first circuit board, where the first circuit board is provided with a first shielding frame on a surface facing toward the second circuit board, the second circuit board is provided with a second shielding frame on a surface facing toward the first circuit board, and opposite end portions of the first shielding frame and the second shielding frame are connected to a shared shielding cover, so that the shared shielding cover, the first shielding frame, and the second shielding frame enclose a shielding cavity. The circuit board assembly and the electronic device in the embodiments of this application can solve the problem that the stacked circuit boards occupy a large vertical space in the related art.
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