-
公开(公告)号：EP4192214A1
公开(公告)日：2023-06-07
申请号：EP22859566.6
申请日：2022-08-22
发明人： GUO, Jianqiang , LUO, Wenjun , LI, Jun
IPC分类号： H05K9/00
摘要： Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes: a first circuit board and a second circuit board stacked with the first circuit board, where the first circuit board is provided with a first shielding frame on a surface facing toward the second circuit board, the second circuit board is provided with a second shielding frame on a surface facing toward the first circuit board, and opposite end portions of the first shielding frame and the second shielding frame are connected to a shared shielding cover, so that the shared shielding cover, the first shielding frame, and the second shielding frame enclose a shielding cavity. The circuit board assembly and the electronic device in the embodiments of this application can solve the problem that the stacked circuit boards occupy a large vertical space in the related art.
-
公开(公告)号：EP4354661A3
公开(公告)日：2024-10-02
申请号：EP23212732.4
申请日：2021-04-13
发明人： GUO, Jianqiang , BAI, Liang , YE, Lianjie , LUO, Wenjun , LI, Zhihai
摘要： An electronic device, relating to the technical field of antennas. The electronic device includes a frame, a screen, and a circuit board assembly. The screen is mounted on one side of the frame. A part of the frame forms a radiator of an antenna, or the radiator of the antenna is fixed on an inner side of the frame. The circuit board assembly is located on the inner side of the frame. The circuit board assembly includes a first conductive member, and a first board, an elevating board, and a second board sequentially stacked. The first board is located on one side of the second board away from the screen. The first board includes a first main body portion and a first extension portion connected to the first main body portion. The first main body portion is fixedly connected to the elevating board. The first extension portion protrudes relative to the elevating board and the second board, and is disposed close to the radiator. The first conductive member is fixed to the first extension portion, and is in elastic contact with the radiator. The clearance area of the antenna of the electronic device is larger, and the performance of the antenna is better.
-
公开(公告)号：EP4194132A1
公开(公告)日：2023-06-14
申请号：EP22857075.0
申请日：2022-09-14
发明人： GUO, Jianqiang , LUO, Wenjun , LI, Mingchuan
摘要： This application provides a circuit board assembly soldering apparatus and a circuit board assembly soldering method. The soldering apparatus is provided with at least two bearing seats on a base plate, the bearing seats are located in a space between the base plate and a pressing plate assembly, the bearing seats each include a workbench, the workbench is located on a side of the bearing seat that faces the pressing plate assembly, a circuit board assembly is placed on the workbench, and the pressing plate assembly is pressed on the circuit board assembly on the workbench, so as to provide a pressure on the circuit board assembly and implement soldered connection of the circuit board assembly. At least one adjustable bearing seat is provided, and a spacing between the workbench of the adjustable bearing seat and the base plate is adjustable. Further, a spacing between the workbench of the adjustable bearing seat and the pressing plate assembly is adjusted, to implement soldered connection between circuit board assemblies with different thicknesses. With the circuit board assembly placed on each bearing seat, the soldering apparatus can connect at least two circuit board assemblies by soldering at a single time, and therefore have high soldering efficiency.
-
公开(公告)号：EP4175424A1
公开(公告)日：2023-05-03
申请号：EP22830351.7
申请日：2022-08-18
发明人： GUO, Jianqiang , LUO, Wenjun
摘要： Embodiment of this application provide a circuit board assembly and an electronic device. The circuit board assembly is applied to an electronic device. The circuit board assembly includes at least printed circuit boards, a flexible circuit board, and a support. Two or more printed circuit boards are spaced apart. The printed circuit boards include first pads. Two neighboring printed circuit boards are connected to the flexible circuit board. The flexible circuit board includes a bending region, straight regions, and second pads. Straight regions are respectively arranged on two opposite sides of the bending region. The straight regions are located between the two printed circuit boards. The bending region and the straight regions form an accommodating space. The second pad is arranged in the straight region. The first pad is connected to the second pad. The support is arranged in the accommodating space. The support includes two stacked support bodies. The support body is abutted against the straight region to apply a compressive stress toward the printed circuit board to the straight region. The circuit board assembly according to the embodiments of this application can reduce the possibility that a bending flexible circuit board is prone to tearing at a joint with a printed circuit board.
-
公开(公告)号：EP4044367A1
公开(公告)日：2022-08-17
申请号：EP21788488.1
申请日：2021-04-13
发明人： GUO, Jianqiang , BAI, Liang , YE, Lianjie , LUO, Wenjun , LI, Zhihai
摘要： An electronic device, relating to the technical field of antennas. The electronic device includes a frame, a screen, and a circuit board assembly. The screen is mounted on one side of the frame. A part of the frame forms a radiator of an antenna, or the radiator of the antenna is fixed on an inner side of the frame. The circuit board assembly is located on the inner side of the frame. The circuit board assembly includes a first conductive member, and a first board, an elevating board, and a second board sequentially stacked. The first board is located on one side of the second board away from the screen. The first board includes a first main body portion and a first extension portion connected to the first main body portion. The first main body portion is fixedly connected to the elevating board. The first extension portion protrudes relative to the elevating board and the second board, and is disposed close to the radiator. The first conductive member is fixed to the first extension portion, and is in elastic contact with the radiator. The clearance area of the antenna of the electronic device is larger, and the performance of the antenna is better.
-
公开(公告)号：EP4354661A2
公开(公告)日：2024-04-17
申请号：EP23212732.4
申请日：2021-04-13
发明人： GUO, Jianqiang , BAI, Liang , YE, Lianjie , LUO, Wenjun , LI, Zhihai
IPC分类号： H01Q9/42
摘要： An electronic device, relating to the technical field of antennas. The electronic device includes a frame, a screen, and a circuit board assembly. The screen is mounted on one side of the frame. A part of the frame forms a radiator of an antenna, or the radiator of the antenna is fixed on an inner side of the frame. The circuit board assembly is located on the inner side of the frame. The circuit board assembly includes a first conductive member, and a first board, an elevating board, and a second board sequentially stacked. The first board is located on one side of the second board away from the screen. The first board includes a first main body portion and a first extension portion connected to the first main body portion. The first main body portion is fixedly connected to the elevating board. The first extension portion protrudes relative to the elevating board and the second board, and is disposed close to the radiator. The first conductive member is fixed to the first extension portion, and is in elastic contact with the radiator. The clearance area of the antenna of the electronic device is larger, and the performance of the antenna is better.
-
公开(公告)号：EP4192206A1
公开(公告)日：2023-06-07
申请号：EP22859527.8
申请日：2022-08-18
发明人： GUO, Jianqiang , LUO, Wenjun , YANG, Fan
摘要： Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes at least a frame plate, circuit boards, support bodies, and solder joints. The frame plate includes a frame body and first pads provided on the frame body. The circuit boards each are provided on one side of the frame plate. The circuit board includes a board body and second pads provided on the board body. The first pads face the second pads. The support bodies are provided between the frame plate and the circuit boards. The support bodies are configured to support the circuit boards, so that a predetermined spacing exists between the first pads and the second pads. The support bodies each include a first support portion and a second support portion. The first support portion and the second support portion are stacked along a thickness direction of the frame plate. The first support portion is connected to the frame body. The second support portion is connected to the board body. Solder joints are provided between the first pads and the second pads. The solder joints connect the first pads to the second pads. The circuit board assembly in this application can ensure that a large solder joint is formed between two pads. This is conducive to improving connection strength between the pads.
-
-
-
-
-
-
搜索结果
7 条记录 (耗时 0.01 秒)
