- 专利标题: VIRTUALIZED LINK STATES OF MULTIPLE PROTOCOL LAYER PACKAGE INTERCONNECTS
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申请号: EP23162415.6申请日: 2020-02-12
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公开(公告)号: EP4216066A3公开(公告)日: 2023-11-01
- 发明人: HOR, Joon Teik , SONG, Ting Lok , WAGH, Mahesh , LIM, Su Wei
- 申请人: INTEL Corporation
- 申请人地址: US Santa Clara, CA 95054 2200 Mission College Blvd.
- 代理机构: Samson & Partner Patentanwälte mbB
- 优先权: US201916373472 20190402
- 主分类号: G06F13/42
- IPC分类号: G06F13/42 ; G06F13/38
摘要:
The invention relates to an apparatus comprising arbitration and multiplexer (ARB/MUX) logic to arbitrate data from a plurality of different link layers of a plurality of different protocols of an interconnect; to multiplex data of the plurality of different link layers on a physical layer of the interconnect; to maintain a first virtual link state machine (VLSM) for a first one of the plurality of link layers; and to maintain a second VLSM for a second one of the plurality of link layers; wherein states in the first VLSM and the second VLSM correspond to states defined in a link state machine of the physical layer.
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