Invention Publication
- Patent Title: MOLDING BASE MATERIAL, MOLDED PRODUCT USING SAME, AND PRODUCTION METHOD THEREFOR
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Application No.: EP21875443.0Application Date: 2021-09-24
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Publication No.: EP4223503A1Publication Date: 2023-08-09
- Inventor: MITSUOKA Hideto , KIYAMA Hiroshi , KIMOTO Yukitane , MACHIDA Hideaki , OKUI Masakazu
- Applicant: Toray Industries, Inc. , Du Pont-Toray Co., Ltd.
- Applicant Address: JP Tokyo 103-8666 1-1, Nihonbashi-muromachi, 2-chome Chuo-ku; JP Chuo-ku Tokyo 103-0023 1-1, Nihonbashi-Honcho 1-chome
- Agency: Hoefer & Partner Patentanwälte mbB
- Priority: JP2020163141 20200929
- International Announcement: WO2022071141 20220407
- Main IPC: B32B5/28
- IPC: B32B5/28 ; B29B11/16 ; B29C70/16 ; B32B15/08 ; B32B27/34 ; B29K105/06 ; B29L9/00
Abstract:
Provided are: a molding base material characterized by having at least a fiber-reinforced resin prepreg layer, a fiber paper layer, and a partition layer interposed between the prepreg layer and the fiber paper layer; a molded product obtained using the same; and a production method therefor. The present invention makes it possible to achieve high thermal resistance and heat insulation as well as improved overall space efficiency and weight reduction in a fiber-reinforced resin molded product.
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