公开(公告)号：EP4223503A1

公开(公告)日：2023-08-09

申请号：EP21875443.0

申请日：2021-09-24

申请人： Toray Industries, Inc. ,  Du Pont-Toray Co., Ltd.

发明人： MITSUOKA Hideto ,  KIYAMA Hiroshi ,  KIMOTO Yukitane ,  MACHIDA Hideaki ,  OKUI Masakazu

IPC分类号： B32B5/28 ,  B29B11/16 ,  B29C70/16 ,  B32B15/08 ,  B32B27/34 ,  B29K105/06 ,  B29L9/00

摘要： Provided are: a molding base material characterized by having at least a fiber-reinforced resin prepreg layer, a fiber paper layer, and a partition layer interposed between the prepreg layer and the fiber paper layer; a molded product obtained using the same; and a production method therefor. The present invention makes it possible to achieve high thermal resistance and heat insulation as well as improved overall space efficiency and weight reduction in a fiber-reinforced resin molded product.