发明公开
- 专利标题: SOLID-STATE IMAGING DEVICE
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申请号: EP23188095.6申请日: 2018-07-25
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公开(公告)号: EP4254502A2公开(公告)日: 2023-10-04
- 发明人: KOBAYASHI, Kenji , WAKANO, Toshifumi , OTAKE, Yusuke
- 申请人: Sony Semiconductor Solutions Corporation
- 申请人地址: JP Atsugi-shi, Kanagawa 243-0014 4-14-1 Asahi-cho
- 代理机构: MFG Patentanwälte Meyer-Wildhagen Meggle-Freund Gerhard PartG mbB
- 优先权: JP2017151980 20170804
- 主分类号: H01L27/146
- IPC分类号: H01L27/146
摘要:
The disclosure pertains to a light detecting device that includes: a first pixel (21) and a second pixel (21), wherein the first pixel (21) includes a first semiconductor region (31) and a second semiconductor region (32), and the second pixel (21) includes a third semiconductor region (31) and a fourth semiconductor region (32); and a first wiring layer (23) that includes: a first electrode (37), a first via (38) coupled to the first electrode (37) and the first semiconductor region (31), and a second via (38) coupled to the first electrode (37) and the third semiconductor region (31); wherein a conductivity type of the first semiconductor region (31) is opposite to a conductivity type of the second semiconductor region (32).
公开/授权文献
- EP4254502A3 SOLID-STATE IMAGING DEVICE 公开/授权日:2024-01-10
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