- 专利标题: METAL OXIDE THIN-FILM TRANSISTOR AND MANUFACTURING METHOD THEREFOR, DISPLAY PANEL AND DISPLAY APPARATUS
-
申请号: EP21955429.2申请日: 2021-08-31
-
公开(公告)号: EP4345910A1公开(公告)日: 2024-04-03
- 发明人: LIN, Bin , LI, Liangliang , LIU, Zheng , HU, Bo , ZHANG, Rui , PENG, Xinlin
- 申请人: BOE Technology Group Co., Ltd. , Fuzhou Boe Optoelectronics Technology Co., Ltd.
- 申请人地址: CN Chaoyang District, Beijing 100015 No. 10 Jiuxianqiao Rd.,; CN Fuzhou, Fujian 350300 No. 36 Xihuanbei Road Dianthus Street Fuqing
- 代理机构: Haseltine Lake Kempner LLP
- 国际公布: WO2023028872 20230309
- 主分类号: H01L29/786
- IPC分类号: H01L29/786 ; H01L29/417
摘要:
The present disclosure relates to a metal oxide thin-film transistor and a manufacturing method therefor, a display panel and a display apparatus, which belong to the technical field of displays. The metal oxide thin-film transistor comprises a gate electrode, a gate insulating layer, a metal oxide semiconductor layer, a source electrode and a drain electrode, and a passivation layer, which are sequentially arranged on a base substrate, wherein the source electrode and the drain electrode each have a stacked structure, the stacked structure of the source electrode or the drain electrode at least comprises a main body metal layer and an electrode protection layer, and the electrode protection layer contains metal or metal alloy; the electrode protection layer is at least arranged between the metal oxide semiconductor layer and the main body metal layer; a metal oxide layer is provided between the electrode protection layer and the main body metal layer, and a metal element of the metal oxide layer comprises at least one of a metal element of the main body metal layer and a metal element of the electrode protection layer; the thickness of the metal oxide layer does not exceed 2% of the thickness of either one of the source electrode and the drain electrode; and the thickness of the metal oxide layer does not exceed 10% of the thickness of the electrode protection layer.
信息查询
IPC分类: