- 专利标题： SUBSTRATE FOR HIGH-FREQUENCY DEVICE
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申请号： EP22820078.8申请日： 2022-05-30
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公开(公告)号： EP4353475A1公开(公告)日： 2024-04-17
- 发明人: OKUDA, Ryota , KAKIUCHI, Toshifumi
- 申请人： AGC INC.
- 申请人地址： JP Chiyoda-ku, Tokyo 1008405 5-1, Marunouchi 1-chome,
- 专利权人： AGC INC.
- 当前专利权人： AGC INC.
- 当前专利权人地址： JP Chiyoda-ku, Tokyo 1008405 5-1, Marunouchi 1-chome,
- 代理机构： Müller-Boré & Partner Patentanwälte PartG mbB
- 优先权： JP 2021095543 2021.06.08
- 国际申请： JP2022021930 2022.05.30
- 国际公布： WO2022259896 2022.12.15
- 主分类号： B32B17/10
- IPC分类号： B32B17/10 ; H01Q1/38 ; H05K1/03
摘要：
To provide a substrate for a high frequency device, which satisfies requirements of low dielectric loss tangent, adhesion and transparency.
A substrate for a high frequency device comprising a transparent glass substrate 16 and a transparent resin base material 20 bonded to the glass substrate 16 via an optical clear adhesive 18, wherein the dielectric loss tangent of the resin base material 20 in dielectric loss tangent measurement test is 0.01 or less, the peel strength in peel test is 3.0 N/cm or more, and the amount of out gas in out gas test is 5.0 µg/g or less.
A substrate for a high frequency device comprising a transparent glass substrate 16 and a transparent resin base material 20 bonded to the glass substrate 16 via an optical clear adhesive 18, wherein the dielectric loss tangent of the resin base material 20 in dielectric loss tangent measurement test is 0.01 or less, the peel strength in peel test is 3.0 N/cm or more, and the amount of out gas in out gas test is 5.0 µg/g or less.
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