- 专利标题: ASSEMBLY METHOD FOR ELECTRONIC APPARATUS AND ASSEMBLY METHOD FOR PROJECTION DISPLAY APPARATUS
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申请号: EP23215501.0申请日: 2023-12-11
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公开(公告)号: EP4387013A1公开(公告)日: 2024-06-19
- 发明人: SHIMADA, Yuji
- 申请人: Seiko Epson Corporation
- 申请人地址: JP Tokyo 160-8801 1-6, Shinjuku 4-chome, Shinjuku-ku,
- 专利权人: Seiko Epson Corporation
- 当前专利权人: Seiko Epson Corporation
- 当前专利权人地址: JP Tokyo 160-8801 1-6, Shinjuku 4-chome, Shinjuku-ku,
- 代理机构: MERH-IP Matias Erny Reichl Hoffmann Patentanwälte PartG mbB
- 优先权: JP 22198030 2022.12.12
- 主分类号: H01R43/26
- IPC分类号: H01R43/26 ; B25J15/00 ; H01R12/79
摘要:
An assembly method for an electronic apparatus is assembling an electronic apparatus by performing coupling work of a branched flat cable including a base end portion and a first end portion and a second end portion branched from the base end portion and having flexibility using an assembly apparatus. The assembly apparatus includes a suction unit, a gripping unit, a robot arm unit, and a control unit. The method includes a first gripping step of gripping a first end portion, a first coupling step of coupling the first end portion to a first connector, a first release step of releasing the gripping, a suction step of suctioning a second end portion, a second gripping step of gripping the second end portion, a second coupling step of coupling the second end portion to a second connector, and a second release step of releasing the gripping of the second end portion.
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