- 专利标题: METHOD AND APPARATUS FOR PREPARING QUANTUM CHIP, AND ELECTRONIC DEVICE, COMPUTER-READABLE STORAGE MEDIUM, COMPUTER PROGRAM PRODUCT AND QUANTUM CHIP
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申请号: EP23825938.6申请日: 2023-04-25
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公开(公告)号: EP4398011A1公开(公告)日: 2024-07-10
- 发明人: LI, Dengfeng , ZHANG, Wenlong , DAI, Maochun , BU, Kunliang , HUAI, Sainan
- 申请人: Tencent Technology (Shenzhen) Company Limited
- 申请人地址: CN Shenzhen, Guangdong, 518057 35/F, Tencent Building Kejizhongyi Road Midwest District of Hi-tech Park Nanshan District
- 专利权人: Tencent Technology (Shenzhen) Company Limited
- 当前专利权人: Tencent Technology (Shenzhen) Company Limited
- 当前专利权人地址: CN Shenzhen, Guangdong, 518057 35/F, Tencent Building Kejizhongyi Road Midwest District of Hi-tech Park Nanshan District
- 代理机构: Gunzelmann, Rainer
- 优先权: CN 2210713974 2022.06.22
- 国际申请: CN2023090539 2023.04.25
- 国际公布: WO2023246285 2023.12.28
- 主分类号: G02B6/136
- IPC分类号: G02B6/136 ; G06N10/80
摘要:
Provided in the present application are a method and apparatus for preparing a quantum chip, and an electronic device, a computer-readable storage medium, a computer program product and a quantum chip. The method comprises: determining an initial intrinsic frequency of a chip substrate; on the basis of a comparison result between the value of the initial intrinsic frequency and the value of a quantum working frequency, performing pattern etching treatment on a first surface of the chip substrate, so as to obtain a chip substrate which has a complete second surface and has a target pattern on the first surface, wherein the quantum working frequency is the working frequency of quantum bits of a quantum circuit, the second surface is opposite the first surface, and the target pattern is a pattern when the difference value between the intrinsic frequency of the chip substrate and the quantum working frequency is the maximum; and etching the second surface of the chip substrate which has been subjected to the pattern etching treatment,, so as to form the quantum circuit, thereby forming a quantum chip.
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