CUTTING POSITION DESIGNATION DEVICE, CUTTING POSITION DESIGNATION METHOD, CUTTING SYSTEM, AND X-RAY INSPECTION DEVICE
摘要:
Obj ect
To provide a cutting position designation device, a cutting position designation method, a cutting system, and an X-ray inspection device that can yield a product having a favorable shape.
Resolution means
An X-ray inspection device (10) includes an X-ray irradiation unit (6) configured to irradiate an article (G) with X-rays, the article (G) being conveyed by a conveyor (5), an X-ray detection unit (7) configured to detect the X-rays emitted by the X-ray irradiation unit (6) and transmitted through the article (G), and a designation unit (30C) configured to designate a plurality of cutting positions (C) with respect to the article (G) on the basis of a detection result by the X-ray detection unit (7). The designation unit (30C) designates a first cutting position (C1) so as to obtain a segment (B) having a set mass corresponding to a cut weight, and in a case in which a width of the segment (B) in a predetermined direction is less than a threshold value at the first cutting position (C1), adds a product weight to the set mass, the product weight being a target amount when the segment (B) is to be further divided, and designates a second cutting position (C2) so as to obtain the segment (B) having the set mass including the product weight.
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