- 专利标题: ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION MEMBER
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申请号: EP24718022.7申请日: 2024-02-06
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公开(公告)号: EP4435965A1公开(公告)日: 2024-09-25
- 发明人: PARK, Woojin , LEE, Seunghwan , SEO, Junghoon , LEE, Hanyeop , LIM, Gun , CHOI, Jinchul
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR Suwon-si, Gyeonggi-do 16677 129, Samsung-ro Yeongtong-gu
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-si, Gyeonggi-do 16677 129, Samsung-ro Yeongtong-gu
- 代理机构: Gulde & Partner
- 优先权: KR 230015412 2023.02.06
- 国际申请: KR2024001692 2024.02.06
- 国际公布: WO2024167258 2024.08.15
- 主分类号: H01Q1/02
- IPC分类号: H01Q1/02 ; H05K7/20
摘要:
An electronic device according to an embodiment of the disclosure may include a first heat dissipating plate that is made of a metallic material and includes a first antenna including a first opening extending in a first direction and a second opening extending in a second direction and connected to the first opening, a first printed circuit board disposed on the first heat dissipating plate and including a feeding part that overlaps with at least a part of the first opening and the second opening, is made of a metallic material, and is electrically connected to the communication module of the electronic device, and a heat dissipating fin made of a metallic material and disposed on the first heat dissipating plate in a direction perpendicular to the first direction and the second direction.
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