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    APPARATUS AND METHOD FOR PROVIDING SERVICE NETWORK IN WIRELESS COMMUNICATION SYSTEM
    1.
    发明公开
    APPARATUS AND METHOD FOR PROVIDING SERVICE NETWORK IN WIRELESS COMMUNICATION SYSTEM 审中-公开

    公开(公告)号：EP4297296A1

    公开(公告)日：2023-12-27

    申请号：EP22771816.0

    申请日：2022-03-18

    申请人： Samsung Electronics Co., Ltd.

    发明人： KIM, Jinsu ,  KIM, Jisang ,  LEE, Chunsoo ,  JEONG, Soonin ,  CHOI, Jinchul

    IPC分类号： H04B10/2575 ,  H04B10/80 ,  H01B9/00 ,  H01B11/22 ,  G02B6/44

    摘要： Embodiments of the present disclosure comprise: a first communication circuit including a first transceiver and a first fiber optic transceiver for transmitting and receiving a signal in a first frequency band, and a second communication circuit including a second transceiver and a second fiber optic transceiver for transmitting and receiving a signal in a second frequency band, wherein the second communication circuit may receive information regarding the second frequency band, and transmit the information to the first communication circuit via the second fiber optic transceiver; the first communication circuit may receive the information via the first fiber optic transceiver, and transmit the information to a terminal; the first fiber optic transceiver may be connected to the second fiber optic transceiver; and a lowest frequency in the second frequency band may be higher than the highest frequency in the first frequency band. Other various embodiments may be possible.

    ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION MEMBER
    2.
    发明公开
    ELECTRONIC DEVICE COMPRISING HEAT DISSIPATION MEMBER 审中-实审

    公开(公告)号：EP4435965A1

    公开(公告)日：2024-09-25

    申请号：EP24718022.7

    申请日：2024-02-06

    申请人： Samsung Electronics Co., Ltd.

    发明人： PARK, Woojin ,  LEE, Seunghwan ,  SEO, Junghoon ,  LEE, Hanyeop ,  LIM, Gun ,  CHOI, Jinchul

    IPC分类号： H01Q1/02 ,  H05K7/20

    摘要： An electronic device according to an embodiment of the disclosure may include a first heat dissipating plate that is made of a metallic material and includes a first antenna including a first opening extending in a first direction and a second opening extending in a second direction and connected to the first opening, a first printed circuit board disposed on the first heat dissipating plate and including a feeding part that overlaps with at least a part of the first opening and the second opening, is made of a metallic material, and is electrically connected to the communication module of the electronic device, and a heat dissipating fin made of a metallic material and disposed on the first heat dissipating plate in a direction perpendicular to the first direction and the second direction.