The present application can provide a compound, a release composition, a release layer, a release film, and a pressure-sensitive adhesive film. The present application can provide a compound that can form a release layer which enables to exhibit an appropriate level of release peel force, and has an excellent bonding force with a base film and excellent solvent resistance. In addition, the present application can provide a compound that when the release layer has been formed, the release layer exhibits a stable residual adhesion rate even in the case of being repeatedly applied to a pressure-sensitive adhesive layer, and the like. The present application can also provide a release composition and a release layer comprising the compound, and a release film and a pressure-sensitive adhesive film comprising the release layer.