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公开(公告)号:EP4450550A1
公开(公告)日:2024-10-23
申请号:EP23753217.1
申请日:2023-02-10
申请人: LG Chem, Ltd.
发明人: PARK, Jun Hyoung , KIM, Hyun Cheol
IPC分类号: C08K5/5419 , C08K5/544 , C08K5/56 , C08L83/04 , C08G77/20 , C08G77/12 , C09D183/04 , C09D7/63
摘要: The present application can provide a polyorganosiloxane and a release composition that can form a release layer capable of securing solvent resistance by maximizing a bonding force between a base film and the release layer. Also, the present application can provide a polyorganosiloxane and a release composition that can form a release layer capable of having an appropriate peel force even under room temperature and high temperature conditions, having a little change in the peel force even under high temperature and ultraviolet irradiation conditions, and securing an excellent residual adhesion rate. In addition, the present application can provide a release layer, and a release film and a pressure-sensitive adhesive film comprising the release layer as applications of the polyorganosiloxane and the release composition.
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公开(公告)号:EP3705531B1
公开(公告)日:2024-09-25
申请号:EP18874639.0
申请日:2018-10-30
IPC分类号: C08L71/00 , C08G77/46 , C08G77/50 , C08K5/057 , C08K5/5415 , C08K5/5419 , C08K5/57 , C08G65/00 , C08G65/336
CPC分类号: C08G65/007 , C08G65/336 , C09D171/00
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公开(公告)号:EP4172246B1
公开(公告)日:2024-08-07
申请号:EP20734536.4
申请日:2020-06-24
IPC分类号: C08G77/16 , C08G77/18 , C08G77/26 , C08G77/00 , C08K5/00 , C08K5/5415 , C08K5/5419 , C08K5/544 , C08L83/04 , C08L83/06 , C09D183/04 , C09D183/06
CPC分类号: C08G77/16 , C08G77/18 , C08G77/26 , C08G77/70 , C09D183/06 , C08L83/06 , C08K5/544 , C08K5/5419 , C08K5/5415 , C08K5/0041 , C08L83/04 , C09D183/04
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公开(公告)号:EP3387059B1
公开(公告)日:2023-10-11
申请号:EP16822554.8
申请日:2016-11-30
发明人: LI, Dachao , DRAZBA, Jessica D. , TALREJA, Manish , COGEN, Jeffrey M. , PERSON, Timothy J. , CARONIA, Paul J.
IPC分类号: C08K5/375 , C08K5/5419 , C08K5/372
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公开(公告)号:EP3589687B1
公开(公告)日:2023-09-06
申请号:EP18706116.3
申请日:2018-02-07
IPC分类号: C08K5/05 , C08K5/5419 , C09J183/04 , C08L83/00 , C08L83/04 , E06B3/663 , E06B3/673 , C08G77/16 , C08G77/18
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公开(公告)号:EP4166614A1
公开(公告)日:2023-04-19
申请号:EP21830914.4
申请日:2021-04-05
发明人: KATAISHI Takumi , KIMURA, Yuko
IPC分类号: C08L83/07 , C08K5/01 , C08K5/5419
摘要: A silicone gel composition of the present invention contains the following components: A 100 parts by mass of an organopolysiloxane that is curable by an addition reaction; B. 0.01 to 10 parts by mass of an unsaturated hydrocarbon compound having one alkenyl group per molecule; and C. an addition reaction curing catalyst in a catalytic amount. The unsaturated hydrocarbon compound is at least one selected from the group consisting of an α-olefin that is liquid at room temperature (25°C) and does not volatilize or decompose at 100°C and α-methylstyrene. A silicone gel sheet of the present invention is obtained by molding the silicone gel composition into a sheet, and curing the sheet.
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公开(公告)号:EP4165100A1
公开(公告)日:2023-04-19
申请号:EP21734732.7
申请日:2021-06-07
发明人: ZHOU, Weijun , MOSCIATTI, Thomas
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公开(公告)号:EP3998310A1
公开(公告)日:2022-05-18
申请号:EP21213245.0
申请日:2018-12-14
发明人: OZTURK, Cem , KORKMAZ, Deniz
IPC分类号: C08L63/00 , C08J5/24 , C08G59/40 , C08G59/50 , C09J163/00 , C08K3/36 , C08K5/21 , C08K5/25 , C08K5/315 , C08K5/3435 , C08K5/3492 , C08K5/5419 , C08K9/06
摘要: A method of producing a hot melt epoxy resin system that is fast curable, isothermal press curable, hot demoldable capable under three minutes at 150 °C and Class A surface giving and suitable to use in the production of automotive interior composite parts characterized by comprising the steps of providing the epoxy resin composition which comprising an epoxy resin mixture comprising a first resin and a second resin; at least one thermoplastic toughener; at least one UV hindered amine light stabilizer; at least one UV absorber and/or blocker; 1,3,5-tris(4-tert.-butyl-3-hydroxy-2,6-dimethylbenzyl)-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione as anti-oxidant; hydrophobic fumed silica as air release/rheology agent and hexamethyldisiloxane as an internal mold release agent, by adding all individual components of said epoxy resin composition into a first vessel and heating the mixture at 90°C and for 30 minutes while stirring; obtaining a curing agent/catalyst paste composition by adding all individual components of said curing agent/catalyst paste composition into a second vessel and mixing them with a mixer at 1000 rpm for 15 minutes; heating the obtained epoxy resin composition at 65 °C for 3 hours adding heated epoxy resin in a container than adding curing agent/catalyst paste composition in same container and mixing them at 60° C for 6 minutes at 1000 rpm to obtain hot melt epoxy resin system.
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9.
公开(公告)号:EP3225662B1
公开(公告)日:2022-04-13
申请号:EP15863390.9
申请日:2015-10-21
发明人: KITAZAWA, Keita , MASUDA, Kohei
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公开(公告)号:EP3130632B1
公开(公告)日:2022-03-30
申请号:EP15776667.6
申请日:2015-03-26
发明人: FUJISAWA, Toyohiko , KODAMA, Harumi
IPC分类号: C08K5/549 , C08K5/5419 , C08K5/5435 , C08L83/04 , C09D183/04 , C09J183/04 , C09K3/10
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