Invention Patent
- Patent Title: Flux for soldering, and solder paste composite
- Patent Title (中): 用于焊接的焊剂和焊膏复合材料
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Application No.: JP2006239288Application Date: 2006-09-04
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Publication No.: JP2008062242APublication Date: 2008-03-21
- Inventor: CHIBA MASAYUKI , WATABE MASAHIRO , AIHARA MASAMI
- Applicant: Harima Chem Inc , ハリマ化成株式会社
- Assignee: Harima Chem Inc,ハリマ化成株式会社
- Current Assignee: Harima Chem Inc,ハリマ化成株式会社
- Priority: JP2006239288 2006-09-04
- Main IPC: B23K35/363
- IPC: B23K35/363 ; B23K35/22 ; H05K3/34
Abstract:
PROBLEM TO BE SOLVED: To provide a flux for soldering, which flux can sufficiently suppress the generation of cracks on a residue of the flux after soldering, and also has high reliability and excellent soldering performance, and is equivalent to a conventional flux in a manufacturing cost and an effect on environments, and further to provide a solder paste composite.
SOLUTION: The flux for soldering contains low softening point rosin having a softening point of 60°C or low as a base resin. It is preferable that the low softening point rosin contains secodehydroabietic acid and/or thermolysis components of rosin, and the content of the secodehydroabietic acid and/or the thermolysis components is 5 wt.% or more of the low softening point rosin. Further, it is preferable that the content of the low softening point rosin is 0.5 to 80 wt.% of the total amount of the flux. The solder paste composite contains the flux and powder of a solder alloy.
COPYRIGHT: (C)2008,JPO&INPIT
SOLUTION: The flux for soldering contains low softening point rosin having a softening point of 60°C or low as a base resin. It is preferable that the low softening point rosin contains secodehydroabietic acid and/or thermolysis components of rosin, and the content of the secodehydroabietic acid and/or the thermolysis components is 5 wt.% or more of the low softening point rosin. Further, it is preferable that the content of the low softening point rosin is 0.5 to 80 wt.% of the total amount of the flux. The solder paste composite contains the flux and powder of a solder alloy.
COPYRIGHT: (C)2008,JPO&INPIT
Public/Granted literature
- JP4819624B2 Soldering flux and solder paste composition Public/Granted day:2011-11-24
Information query
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