Invention Patent
JP2008189765A Liquid curable composition, method of coating, inorganic substrate plate and semiconductor device
有权
液体可固化组合物,涂层方法,无机基板和半导体器件
- Patent Title: Liquid curable composition, method of coating, inorganic substrate plate and semiconductor device
- Patent Title (中): 液体可固化组合物,涂层方法,无机基板和半导体器件
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Application No.: JP2007024477Application Date: 2007-02-02
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Publication No.: JP2008189765APublication Date: 2008-08-21
- Inventor: HARIHARA YUKINARI , ITO MAKI , KATSOULIS DIMITRIS ELIAS
- Applicant: Dow Corning Corp , Dow Corning Toray Co Ltd , ダウ コーニング コーポレーション , 東レ・ダウコーニング株式会社
- Assignee: Dow Corning Corp,Dow Corning Toray Co Ltd,ダウ コーニング コーポレーション,東レ・ダウコーニング株式会社
- Current Assignee: Dow Corning Corp,Dow Corning Toray Co Ltd,ダウ コーニング コーポレーション,東レ・ダウコーニング株式会社
- Priority: JP2007024477 2007-02-02
- Main IPC: C09D183/05
- IPC: C09D183/05 ; B05D7/24 ; B32B27/00 ; C01B33/18 ; C08G77/12 ; C08G77/58 ; C09D1/00 ; C09D183/04 ; C09D185/00
Abstract:
PROBLEM TO BE SOLVED: To provide a liquid curable composition excellent in preservation stability and capable of forming a hard silica-based layer; a method of coating, capable of forming a hard silica-based layer excellent in uniformity, flatness, crack resistance and close adhesion; an inorganic substrate plate excellent in heat resistance, cold resistance, electric insulation, mechanical strength, chemical resistance, etc.; and a semiconductor device excellent in accuracy, reliability and stability over a long period of time. SOLUTION: This liquid curable composition is obtained by performing the condensation reaction or hydrolytic condensation reaction of a hydrogen halosilane or an alkoxysilane in an organic solvent dispersed with polyvalent metal oxide fine particles having hydroxy group. The method for coating the inorganic substrate plate is provided by coating the composition on the inorganic substrate plate and curing to form the hard silica-based layer. The inorganic substrate plate having the hard silica-based layer and the semiconductor device having the semiconductor layer on the above inorganic substrate plate are also provided. COPYRIGHT: (C)2008,JPO&INPIT
Public/Granted literature
- JP5149512B2 Public/Granted day:2013-02-20
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