Invention Patent
- Patent Title: Dicing die bond film
- Patent Title (中): DICING DIE BOND FILM
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Application No.: JP2010153635Application Date: 2010-07-06
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Publication No.: JP2012018949APublication Date: 2012-01-26
- Inventor: KAMIYA KATSUHIKO , MATSUMURA TAKESHI , MURATA SHUHEI , OTAKE HIRONAO
- Applicant: Nitto Denko Corp , 日東電工株式会社
- Assignee: Nitto Denko Corp,日東電工株式会社
- Current Assignee: Nitto Denko Corp,日東電工株式会社
- Priority: JP2010153635 2010-07-06
- Main IPC: H01L21/301
- IPC: H01L21/301 ; C09J7/02 ; C09J133/08
Abstract:
PROBLEM TO BE SOLVED: To provide a dicing die bond film which has a dicing film having an adhesive layer on a base material and a die bond film formed on the adhesive layer, and can exert good holding power and good detachability for a semiconductor wafer with good balance during dicing.SOLUTION: A dicing die bond film comprises a dicing film 11 having an adhesive layer 2 on a base material 1 and a die bond film 3' formed on the adhesive layer 2, the adhesive layer 2 contains a cured material of a polymer P by ultraviolet irradiation, a polymer A comprising monomer component containing an acrylic ester as a main monomer and an oxazoline group-containing monomer reacts with a carboxyl group-containing compound B containing a carboxyl group and radical reactive carbon-carbon double bond to obtain the polymer P, and the die bond film 3' contains an epoxy resin.
Information query
IPC分类:
