公开(公告)号：JP2014167092A

公开(公告)日：2014-09-11

申请号：JP2013255824

申请日：2013-12-11

Applicant: Nitto Denko Corp ,  日東電工株式会社

Inventor： FURUTA KENJI ,  TERADA YOSHIO ,  OTAKE HIRONAO

IPC: C09J133/00 ,  C09J7/00 ,  C09J11/04

Abstract: PROBLEM TO BE SOLVED: To provide a flame retardant adhesive composition which forms an adhesive layer excellent in flame retardancy and also excellent in adhesiveness.SOLUTION: A flame retardant adhesive composition comprises an acrylic polymer, and a metal hydroxide having an average particle diameter of 10 μm or less and/or a hydrated metal compound having an average particle diameter of 10 μm or less. When the 180° peel adhesive force of an adhesive layer formed by a composition prepared by removing the metal hydroxide and the hydrated metal compound from the flame retardant adhesive composition is represented by an adhesive force A and the 180° peel adhesive force of an adhesive layer formed by the flame retardant adhesive composition is represented by an adhesive force B, a ratio of the adhesive force B to the adhesive force A (adhesive force B/adhesive force A) is 0.8 or more. The adhesive layer formed by the flame retardant adhesive composition has a flame retardancy of VTM-0 or VTM-1 in the flame retardancy test according to UL94 standards.

Abstract translation: 要解决的问题：提供一种阻燃性粘合剂组合物，其形成阻燃性优异并且粘合性优异的粘合剂层。溶解性：阻燃剂粘合剂组合物包含丙烯酸类聚合物和平均粒径为10的金属氢氧化物 μm以下和/或平均粒径为10μm以下的水合金属化合物。 当通过由阻燃粘合剂组合物除去金属氢氧化物和水合金属化合物制备的组合物形成的粘合剂层的180°剥离粘合力由粘合力A和粘合剂层的180°剥离粘合力表示时 通过粘合力B表示粘合力B与粘合力A的比例（粘合力B /粘合力A）为0.8以上。 由阻燃粘合剂组合物形成的粘合剂层根据UL94标准在阻燃性试验中具有VTM-0或VTM-1的阻燃性。

公开(公告)号：JP2012236980A

公开(公告)日：2012-12-06

申请号：JP2012094497

申请日：2012-04-18

Applicant: Nitto Denko Corp ,  日東電工株式会社

Inventor： FURUSO MASASHI ,  KAMIYA KATSUHIKO ,  OTAKE HIRONAO

IPC: C09J133/00 ,  C09J7/02 ,  C09J11/06 ,  C09J133/04 ,  C09J133/06 ,  C09J163/00

CPC classification number: C09J133/08

Abstract: PROBLEM TO BE SOLVED: To provide an aqueous dispersion type tacky adhesive composition which can form a tacky adhesive layer that does not substantially contain an organic solvent, excels in coating appearance, and can maintain an adhesion property for a prolonged period.SOLUTION: The aqueous dispersion type tacky adhesive composition includes: an acrylic emulsion polymer (A); and a compound (B) which has a solubility in water (25°C) of at least 1 g/100 g, and has, in the molecule, at least two substituents bonded to the nitrogen atom represented by formula (1). In the formula, R represents one divalent group selected from a group consisting of a 1-10C straight chain or branched alkylene, phenylene, alkyl group-substituted phenylene, halogen-substituted phenylene, and heteroatom-containing alkylene.

Abstract translation: 要解决的问题：提供一种水分散型粘合剂组合物，其可以形成基本上不含有机溶剂的粘性粘合剂层，涂层外观优异，并且可以长时间保持粘合性能。 水分散型粘性粘合剂组合物包括：丙烯酸乳液聚合物（A）; 和在水（25℃）中的溶解度为至少1g / 100g的化合物（B），并且在分子中具有与式（1）表示的氮原子键合的至少两个取代基。 在该式中，R表示选自1-10C直链或支链亚烷基，亚苯基，烷基取代的亚苯基，卤素取代的亚苯基和含杂原子的亚烷基的一个二价基团。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2012017377A

公开(公告)日：2012-01-26

申请号：JP2010154448

申请日：2010-07-07

Applicant: Nitto Denko Corp ,  日東電工株式会社

Inventor： KAMIYA KATSUHIKO ,  TAKAHASHI TOMOKAZU ,  KITANO CHIE ,  OKADA MIYOSHI ,  OTAKE HIRONAO ,  FURUSO MASASHI

IPC: C09J133/00 ,  C08F20/18 ,  C09J7/02 ,  H01L21/301 ,  H01L21/304

CPC classification number: H01L2224/2919 ,  H01L2924/01006 ,  H01L2924/01075 ,  H01L2924/0665 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an active energy ray-curable pressure-sensitive adhesive for re-release, which has a small influence on an environment or a human body, can be easily handled, can largely change its pressure-sensitive adhesiveness before and after irradiation with an active energy ray, and can express high pressure-sensitive adhesiveness before the irradiation with the active energy ray and express high releasability after the irradiation with the active energy ray.SOLUTION: The active energy ray-curable pressure-sensitive adhesive for re-release includes an active energy ray-curable polymer (P), wherein the polymer (P) is obtained by causing an aqueous dispersion of a carboxyl group-containing polymer (A) and an oxazoline group-containing compound (B) which has an oxazoline group and a radical reactive carbon-carbon double bond to react with each other.

Abstract translation: 要解决的问题：为了提供对环境或人体影响小的活性能量射线固化型压敏粘合剂，可以容易地处理，可以大大改变其压敏性 在用活性能量射线照射之前和之后的粘合性，并且可以在用活性能量射线照射之前表达高压敏粘合性，并且在用活性能量射线照射之后表现出高释放性。 解决方案：用于再释放的活性能量射线固化型压敏粘合剂包括活性能量射线固化性聚合物（P），其中聚合物（P）通过使含羧基的水分散体 具有恶唑啉基和自由基反应性碳 - 碳双键的聚合物（A）和含恶唑啉基的化合物（B）彼此反应。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2012015431A

公开(公告)日：2012-01-19

申请号：JP2010152699

申请日：2010-07-05

Applicant: Nitto Denko Corp ,  日東電工株式会社

Inventor： KAMIYA KATSUHIKO ,  MATSUMURA TAKESHI ,  MURATA SHUHEI ,  OTAKE HIRONAO

IPC: H01L21/301 ,  C09J7/02 ,  C09J133/08 ,  H01L21/52

CPC classification number: H01L2224/2919 ,  H01L2924/01006 ,  H01L2924/01075 ,  H01L2924/0665 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a dicing die bond film having a dicing film and a die bond film which (1) ensures good holding power for a semiconductor wafer when it is diced, and good detachability of a semiconductor chip from a substrate regardless of the size or the thickness of the semiconductor wafer or the semiconductor chip, (2) has little impact on the environment or human health, and (3) can be handled easily.SOLUTION: A dicing die bond film 11 includes a dicing film having an adhesive layer 2 on a substrate 1, and a die bond film 3'. The adhesive layer contains a polymer (P) cured by UV-irradiation. The polymer (P) is obtained by a reaction of a polymer (A) composed of a constituent containing, as a main monomer, acrylic ester and a monomer containing a carboxyl group, and a compound (B) containing an oxazoline group which has an oxazoline group and a radical reactive carbon-carbon double bond. The die bond film contains epoxy resin.

Abstract translation: 要解决的问题：提供一种具有切割膜和芯片接合膜的切割模片接合膜，（1）当切割时确保半导体晶片的良好的保持力，并且半导体芯片从 衬底，而与半导体晶片或半导体芯片的尺寸或厚度无关，（2）对环境或人体健康几乎没有影响，（3）可以容易地处理。 ＆lt; P＆gt;解决方案：切割芯片接合膜11包括在基板1上具有粘合剂层2的切割膜和芯片接合膜3'。 粘合剂层含有通过UV照射固化的聚合物（P）。 聚合物（P）通过由含有作为主要单体的成分的丙烯酸酯和含有羧基的单体组成的聚合物（A）和含有恶唑啉基的化合物（B） 恶唑啉基和自由基反应性碳 - 碳双键。 芯片接合膜含有环氧树脂。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2010262970A

公开(公告)日：2010-11-18

申请号：JP2009110576

申请日：2009-04-30

Applicant: Nitto Denko Corp ,  日東電工株式会社

Inventor： OTAKE HIRONAO ,  KAMIYA KATSUHIKO

IPC: H01L21/52 ,  C09J7/02 ,  C09J11/04 ,  C09J133/08 ,  H01L21/301

CPC classification number: B32B7/12 ,  B32B7/10 ,  B32B27/30 ,  H01L2224/83101 ,  Y10T428/28 ,  Y10T428/2891

Abstract: PROBLEM TO BE SOLVED: To provide a laminated film for easily peeling a semiconductor chip with a die adhesive layer from an adhesive sheet in a pick-up step, with the die adhesive layer being prevented from contaminated. SOLUTION: The laminated film 1 has such configuration as a die adhesive layer 3 is laminated on an adhesive agent layer 2b of an adhesive sheet 2, and is used for a manufacturing step of a semiconductor device. The adhesive agent layer 2b of the adhesive sheet 2 contains water carriers, and the gel fraction of the adhesive agent layer 2b is 90 wt.% or higher. The adhesive agent layer 2b is the adhesive agent layer which has an acrylic polymer, whose main monomer component is acrylic acid alkyl ester represented by CH 2 =CHCOOR (R is alkyl group of carbon number 6-10), as base polymer. The percentage of the acrylic acid alkyl ester represented by the formula is preferred to be 50-99 mol% relative to total quantity of monomer component. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于在拾取步骤中从粘合剂片容易地剥离具有模具粘合剂层的半导体芯片的层压膜，防止模具粘合剂层被污染。 解决方案：层叠膜1具有如下构造：将模片粘合剂层3层压在粘合片2的粘合剂层2b上，并用于半导体器件的制造步骤。 粘合剂片2的粘合剂层2b包含水载体，粘合剂层2b的凝胶分数为90重量％以上。 粘合剂层2b是具有丙烯酸类聚合物的粘合剂层，其主要单体组分是由CH 2 SBR = CHCOOR表示的丙烯酸烷基酯（R为碳数为6-10的烷基） ，作为基础聚合物。 由式表示的丙烯酸烷基酯相对于单体组分的总量优选为50-99mol％。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2014185322A

公开(公告)日：2014-10-02

申请号：JP2013268648

申请日：2013-12-26

Applicant: Nitto Denko Corp ,  日東電工株式会社

Inventor： OTAKE HIRONAO ,  NISHIYAMA NAOYUKI ,  FURUTA KENJI ,  TERADA YOSHIO

IPC: C09J7/00 ,  B32B27/00 ,  B32B27/18 ,  B32B27/30 ,  C09J7/02 ,  C09J11/04 ,  C09J133/00

Abstract: PROBLEM TO BE SOLVED: To provide a thin adhesive tape having excellent fire retardancy, also with excellent adhesiveness.SOLUTION: An adhesive tape has an adhesive layer including: an acrylic polymer; and a metalhydroxide having an average particle diameter of 10 μm or smaller and/or a hydrated metal compound having an average particle diameter of 10 μm or smaller. A total content of the metalhydroxide having an average particle diameter of 10 μm or smaller and the hydrated metal compound having an average particle diameter of 10 μm or smaller is 20-330 pts.wt. to 100 pts.wt. of the acrylic polymer. Thickness of the adhesive tape is 70 μm or smaller. In a fire retardancy test of UL94 standard, the adhesive tape has fire retardancy of VTM-0 or VTM-1.

Abstract translation: 要解决的问题：提供具有优异阻燃性的薄粘合带，同时具有优异的粘合性。胶粘剂具有粘合层，包括：丙烯酸类聚合物; 和平均粒径为10μm以下的金属氢氧化物和/或平均粒径为10μm以下的水合金属化合物。 平均粒径为10μm以下的金属氢氧化物和平均粒径为10μm以下的水合金属化合物的总含量为20〜30重量份。 到100磅 的丙烯酸聚合物。 胶带的厚度为70μm以下。 在UL94标准的阻燃试验中，胶带具有VTM-0或VTM-1的阻燃性。

公开(公告)号：JP2012126850A

公开(公告)日：2012-07-05

申请号：JP2010280857

申请日：2010-12-16

Applicant: Nitto Denko Corp ,  日東電工株式会社

Inventor： OTAKE HIRONAO ,  TAKAHASHI AKIKO ,  YAMAMOTO KENICHI

IPC: C09J133/00 ,  C09J7/02 ,  C09J11/06

CPC classification number: C09J133/00

Abstract: PROBLEM TO BE SOLVED: To provide a water-dispersion adhesive composition whose dispersion stability is excellent, wherein an adhesive sheet formed from the composition has excellent adhesiveness to rough surface and water resistance.SOLUTION: The adhesive composition comprises an aqueous dispersion liquid containing an aqueous solvent and an adhesive component dispersed in the aqueous solvent. The adhesive composition contains an acrylic polymer. The adhesive composition further contains a tackifier L having viscosity at 30°C of ≤2,000 Pa s. The adhesive composition further contains a surfactant S having an aryloxy group as a hydrophobic group and an anionic or nonionic hydrophilic group in the molecular structure. Here, the aryloxy group is a phenyloxy group having at least one substituent having an aromatic ring.

Abstract translation: 解决问题的方法为了提供一种分散稳定性优异的水分散性粘合剂组合物，其中由该组合物形成的粘合片具有优异的与粗糙表面的粘附性和耐水性。 解决方案：粘合剂组合物包含含有水性溶剂和分散在水性溶剂中的粘合剂组分的水性分散液。 粘合剂组合物含有丙烯酸类聚合物。 粘合剂组合物还含有粘度在30℃下≤2,000Pa·s的增粘剂L. 粘合剂组合物还含有分子结构中具有芳氧基作为疏水基的表面活性剂S和阴离子或非离子亲水基团。 这里，芳氧基是具有至少一个具有芳环的取代基的苯氧基。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2012018949A

公开(公告)日：2012-01-26

申请号：JP2010153635

申请日：2010-07-06

Applicant: Nitto Denko Corp ,  日東電工株式会社

Inventor： KAMIYA KATSUHIKO ,  MATSUMURA TAKESHI ,  MURATA SHUHEI ,  OTAKE HIRONAO

IPC: H01L21/301 ,  C09J7/02 ,  C09J133/08

CPC classification number: H01L2224/2919 ,  H01L2924/01006 ,  H01L2924/01075 ,  H01L2924/0665 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a dicing die bond film which has a dicing film having an adhesive layer on a base material and a die bond film formed on the adhesive layer, and can exert good holding power and good detachability for a semiconductor wafer with good balance during dicing.SOLUTION: A dicing die bond film comprises a dicing film 11 having an adhesive layer 2 on a base material 1 and a die bond film 3' formed on the adhesive layer 2, the adhesive layer 2 contains a cured material of a polymer P by ultraviolet irradiation, a polymer A comprising monomer component containing an acrylic ester as a main monomer and an oxazoline group-containing monomer reacts with a carboxyl group-containing compound B containing a carboxyl group and radical reactive carbon-carbon double bond to obtain the polymer P, and the die bond film 3' contains an epoxy resin.

Abstract translation: 要解决的问题：提供一种切割模片接合膜，其具有在基材上具有粘合剂层的切割膜和形成在粘合剂层上的芯片接合膜，并且可以发挥良好的保持力和良好的可拆卸性 半导体晶片在切割时具有良好的平衡。 解决方案：切割芯片接合膜包括在基材1上具有粘合剂层2的切割膜11和形成在粘合剂层2上的芯片接合膜3'，粘合剂层2含有聚合物的固化材料 通过紫外线照射，包含含有丙烯酸酯作为主要单体的单体组分和含有恶唑啉基的单体的聚合物A与含羧基和自由基活性碳 - 碳双键的含羧基化合物B反应，得到 聚合物P，并且芯片接合膜3'含有环氧树脂。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2010278427A

公开(公告)日：2010-12-09

申请号：JP2010101713

申请日：2010-04-27

Applicant: Nitto Denko Corp ,  日東電工株式会社

Inventor： OTAKE HIRONAO ,  KAMIYA KATSUHIKO

IPC: H01L21/52 ,  C09J7/02 ,  C09J11/00 ,  C09J11/06 ,  C09J133/04 ,  C09J201/00 ,  H01L21/301

CPC classification number: B32B7/10 ,  B32B7/12 ,  B32B27/26 ,  B32B27/30 ,  H01L21/67011 ,  H01L24/29 ,  H01L2924/15747 ,  H01L2924/15788 ,  Y10T428/269 ,  Y10T428/28 ,  Y10T428/2891 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a laminated film which is superior in dicing property, picking-up property, fouling preventive property and storage stability. SOLUTION: A laminated film 1 has a constitution that a die-adhering layer 3 is laminated on an adhesive layer 2b of an adhesive sheet 2; the adhesive layer of the adhesive sheet is formed of an adhesive composition containing a base polymer and a thermal crosslinking agent, and the adhesive layer is such that a gel fraction, before heating is less than 90 wt.% and the gel fraction after heating, is changed by 90 wt.% or more. As the thermal crosslinking agent, there is suitably used a thermal crosslinking agent where crosslinking-reactive functional groups are inactivated prior to heating; and at least two crosslinking-reactive functional groups in one molecule are capable of being activated by heating. As the thermal crosslinking agent, a blocked isocyanate is preferred. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种层叠膜，其切割性，拾取性，防污性和储存稳定性优异。 解决方案：层压膜1具有在粘合片2的粘合剂层2b上层压模具粘合层3的构造; 粘合片的粘合剂层由含有基础聚合物和热交联剂的粘合剂组合物形成，粘合剂层使加热前的凝胶分数小于90重量％，加热后的凝胶分数， 改变了90重量％以上。 作为热交联剂，优选使用交联反应性官能团在加热前失活的热交联剂; 并且一个分子中至少两个交联反应性官能团能够通过加热活化。 作为热交联剂，优选封端的异氰酸酯。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010153774A

公开(公告)日：2010-07-08

申请号：JP2009174511

申请日：2009-07-27

Applicant: Nitto Denko Corp ,  日東電工株式会社

Inventor： OTAKE HIRONAO ,  KAMIYA KATSUHIKO

IPC: H01L21/301 ,  C09J7/02

CPC classification number: B32B7/12 ,  B32B3/08 ,  B32B5/18 ,  B32B15/04 ,  B32B23/04 ,  B32B27/18 ,  B32B27/20 ,  B32B27/22 ,  B32B27/281 ,  B32B27/285 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  B32B27/365 ,  B32B27/38 ,  B32B27/40 ,  B32B29/002 ,  B32B2255/205 ,  B32B2307/21 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/516 ,  B32B2307/518 ,  B32B2307/54 ,  B32B2457/14 ,  C09J7/35 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/0102 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01059 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19042 ,  Y10T428/31551 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: PROBLEM TO BE SOLVED: To provide a dicing/die-bonding film capable of easily separating a pressure-sensitive adhesive layer from a die adhesive layer, even when a semiconductor wafer is a thin and large size, making it unnecessary to stick both the layers again, after separation and having a high pickup efficiency. SOLUTION: In the dicing/die-bonding film, the pressure-sensitive adhesive layer of the dicing film is an active energy-ray curable type pressure-sensitive layer which contains a gas-generating agent in a ratio of 10 to 200 pts.wt. with respect to 100 pts.wt. of a base polymer which is the following acrylic polymer A. The acrylic polymer A has a composition, obtained by applying addition reaction of an isocyanate compound containing a carbon-carbon double bond to a polymer, based on a monomer composition that contains 50 wt.% or more of acrylic acid alkyl ester, in which the carbon number of an alkyl radical is 6 to 10, and 10 to 30 wt.% of a monomer including hydroxyl radicals and does not contain a monomer that contains carboxyl radicals at addition reaction of 50 to 95 mol% with respect to the monomer containing hydroxyl radicals. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 解决问题的方案为了提供一种能够容易地从压模粘合剂层分离压敏粘合剂层的切割/芯片接合膜，即使半导体晶片是薄而大的尺寸，也不需要粘贴 在分离后，再次具有两层，并且具有高的拾取效率。 解决方案：在切割/芯片接合膜中，切割膜的压敏粘合剂层是含有比例为10至200的气体发生剂的活性能量射线固化型压敏层 重量份 相对于100 pts.wt 的基础聚合物，其为以下丙烯酸类聚合物A.丙烯酸类聚合物A具有通过基于含有50重量份的单体组合物，将含有碳 - 碳双键的异氰酸酯化合物与聚合物进行加成反应而获得的组成。 ％以上丙烯酸烷基酯，其中烷基的碳数为6〜10，10〜30重量％的包含羟基的单体，并且不含有在加成反应时含有羧基的单体 相对于含有羟基的单体为50〜95摩尔％。 版权所有（C）2010，JPO＆INPIT