Invention Patent
JP2012135915A Molding device, and molding method by the molding device 有权
模制装置,以及模制装置的模制方法

Molding device, and molding method by the molding device
Abstract:
PROBLEM TO BE SOLVED: To provide a molding device and a molding method by the molding device, wherein a molding portion of a die can be heated with a simple structure while ensuring the durability of the molding portion.SOLUTION: The molding device 100 includes a first die 110 and a second die 120 for molding a product PR that is an object to be molded. In the first die 110 and the second die 120, a first molding portion 111 and a second molding portion 121 are respectively formed with a first molding portion and a second molding portion at mutually opposing center portions of the dies. The first molding portion 111 and the second molding portion 121 are respectively formed with three-dimensional shapes corresponding to the surface shape of the product PR. Thermal/electrical insulation bodies 113, 124 are provided around the first molding portion 111 and the second molding portion 121 of the first die 110 and the second die 120. Further, the first die 110 and the second die 120 are connected to a power feeding device 136 through input/output electrodes 132, 133, and are joined by joint electrodes 134, 135 so as to be electrically connected or disconnected.
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