Invention Patent
- Patent Title: Molding device, and molding method by the molding device
- Patent Title (中): 模制装置,以及模制装置的模制方法
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Application No.: JP2010288977Application Date: 2010-12-24
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Publication No.: JP2012135915APublication Date: 2012-07-19
- Inventor: TAKAI MITSUO
- Applicant: Cap Co Ltd , 株式会社キャップ
- Assignee: Cap Co Ltd,株式会社キャップ
- Current Assignee: Cap Co Ltd,株式会社キャップ
- Priority: JP2010288977 2010-12-24
- Main IPC: B29C33/02
- IPC: B29C33/02
Abstract:
PROBLEM TO BE SOLVED: To provide a molding device and a molding method by the molding device, wherein a molding portion of a die can be heated with a simple structure while ensuring the durability of the molding portion.SOLUTION: The molding device 100 includes a first die 110 and a second die 120 for molding a product PR that is an object to be molded. In the first die 110 and the second die 120, a first molding portion 111 and a second molding portion 121 are respectively formed with a first molding portion and a second molding portion at mutually opposing center portions of the dies. The first molding portion 111 and the second molding portion 121 are respectively formed with three-dimensional shapes corresponding to the surface shape of the product PR. Thermal/electrical insulation bodies 113, 124 are provided around the first molding portion 111 and the second molding portion 121 of the first die 110 and the second die 120. Further, the first die 110 and the second die 120 are connected to a power feeding device 136 through input/output electrodes 132, 133, and are joined by joint electrodes 134, 135 so as to be electrically connected or disconnected.
Public/Granted literature
- JP5107417B2 Molding method according to the molding apparatus and the molding apparatus Public/Granted day:2012-12-26
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