Invention Patent
- Patent Title: Connector system with thermal cooling function
- Patent Title (中): 具有热冷却功能的连接器系统
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Application No.: JP2012245523Application Date: 2012-11-07
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Publication No.: JP2013102163APublication Date: 2013-05-23
- Inventor: REGNIER KENT E
- Applicant: Molex Inc , モレックス インコーポレイテドMolex Incorporated
- Assignee: Molex Inc,モレックス インコーポレイテドMolex Incorporated
- Current Assignee: Molex Inc,モレックス インコーポレイテドMolex Incorporated
- Priority: US201161556890 2011-11-08; US201261640786 2012-05-01
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
PROBLEM TO BE SOLVED: To provide a connector system suited to manage thermal loads.SOLUTION: A connector includes a heat spreader. The heat spreader is configured to direct heat from ports to a thermal plate that is disposed apart from the connector. A plurality of such connectors can be supported and the heat spreaders can be linked with each of the connectors. One or more thermal plates can be thermally coupled to the corresponding heat spreaders so as to direct thermal energy away from each connector. Cold blocks can be used to thermally couple the heat spreaders to the corresponding thermal plates.
Public/Granted literature
- JP5591902B2 Connector system having a thermal cooling function Public/Granted day:2014-09-17
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