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公开(公告)号：JP2013102164A
公开(公告)日：2013-05-23
申请号：JP2012246076
申请日：2012-11-08
Applicant: Molex Inc , モレックス インコーポレイテドMolex Incorporated
Inventor： REGNIER KENT E , LONG JERRY A
CPC classification number: H01R13/533 , F28F3/02 , G02B6/4201 , H05K7/20509
Abstract: PROBLEM TO BE SOLVED: To provide an input/output connector which achieves excellent heat radiation performance.SOLUTION: A receptacle connector 10 defines a port 30. The port has a spring finger formed so as to engage with a fitting module. The spring finger thermally connects with a heat transmission plate which may be formed so as to provide a part of a cage defining the port. A fin 300 is attached to or integrally provided at the heat transmission plate. During the operation, heat energy from the inserted module is transmitted from the module to the spring finger, then is transmitted to the heat transmission plate, and further is transmitted to a heat radiation system.
Abstract translation: 要解决的问题：提供实现优异的散热性能的输入/输出连接器。 解决方案：插座连接器10限定端口30.端口具有形成为与配件模块接合的弹簧指。 弹簧指与热传递板热连接，传热板可以形成为提供限定端口的笼的一部分。 翅片300附接到或者一体地设置在传热板上。 在操作过程中，插入模块的热能从模块传递到弹簧指，然后被传送到传热板，并进一步传递到散热系统。 版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JP2010199088A
公开(公告)日：2010-09-09
申请号：JP2010109778
申请日：2010-05-12
Applicant: Molex Inc , モレックス インコーポレイテドMolex Incorporated
Inventor： AVERY HAZELTON P , CASHER PATRICK R , NELSON RICHARD A , REGNIER KENT E
IPC: H01R13/658 , H01R24/00
CPC classification number: H05K1/0219 , H01R12/724 , H01R13/6464 , H01R13/6587 , H05K1/0237 , H05K1/0245 , H05K1/116 , H05K3/429 , H05K2201/09236 , H05K2201/09618 , H05K2201/09718 , H05K2201/09809 , H05K2201/10189
Abstract: PROBLEM TO BE SOLVED: To provide one or more of receptacle connectors housing an edge connector of a device such as a circuit board and a receptacle connector of a stacked type housing a differential signal pair in each of outlets, or a receptacle connector of a stacked type capable of assembling the differential signal pair in a connector body by using independent inserts of a wafer shape, each insert comparatively easy to be manufactured and a grounding face arrangeable between each of wafer inserts inside a surrounding connector housing. SOLUTION: Each of stacked type inserts of the connector is provided so as to have side faces of differential signal contacts opposing each other and is fixed to a circuit board having no supplementary width for housing a multi-layered differential signal, and a direction of the contacts is changed from a positioning of differential signal contacts in which each of the side faces is opposed to a positioning in which they are aligned back and forth by using a connector wafer. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation: 要解决的问题：提供一种或多种插座连接器，其容纳诸如电路板的装置的边缘连接器和在每个插座中容纳差分信号对的堆叠式插座连接器或插座连接器 能够通过使用晶片形状的独立插入件，相对容易制造的每个插入件和可围绕在周围连接器壳体内的每个晶片插入件之间布置的接地面，能够将差分信号对组装在连接器主体中。 解决方案：连接器的每个堆叠式插入件设置成具有彼此相对的差动信号触头的侧面，并且固定到没有用于容纳多层差分信号的补充宽度的电路板，并且 触点的方向从差分信号触点的位置改变，其中每个侧面与通过连接器晶片前后对齐的定位相对。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2013211278A
公开(公告)日：2013-10-10
申请号：JP2013119981
申请日：2013-06-06
Applicant: Molex Inc , モレックス インコーポレイテドMolex Incorporated
Inventor： LANG HAROLD KEITH , REGNIER KENT E , JOHN JANTELEZIO
IPC: H01R12/71
CPC classification number: H01R12/716 , H01R13/6584
Abstract: PROBLEM TO BE SOLVED: To provide a connector assembly that is utilized for vertical applications on a circuit board.SOLUTION: A connector assembly that is utilized for vertical applications on a circuit board includes a housing 404 that supports a plurality of wafers 412 that in tern support a plurality of terminals 416. The housing 404 includes a base 430 and a nose 428, has two slots 424 and 426 in the nose 428, and the terminals extend to both slots 424 and 426. A guide frame is positioned on the housing to help support the housing. The terminals are arranged in a row on both sides of the two slots. Each tail 417 of the terminals 416 is in the form of a compliant pin 418 that is received within a via 419 formed in the circuit board.
Abstract translation: 要解决的问题：提供一种用于电路板上的垂直应用的连接器组件。解决方案：用于电路板上的垂直应用的连接器组件包括支撑多个晶片412的壳体404， 支撑多个端子416.壳体404包括底座430和鼻部428，在鼻部428中具有两个槽424和426，并且端子延伸到两个槽424和426。引导框架定位在壳体上 帮助住房。 端子在两个槽的两侧排成一列。 端子416的每个尾部417是形成在形成在电路板中的通孔419中的柔性引脚418的形式。
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公开(公告)号：JP2010123573A
公开(公告)日：2010-06-03
申请号：JP2009260565
申请日：2009-11-16
Applicant: Molex Inc , モレックス インコーポレイテドMolex Incorporated
Inventor： LANG HAROLD KEITH , REGNIER KENT E
IPC: H01R13/658 , H01R13/66
CPC classification number: H01R13/6658 , H01R13/6593
Abstract: PROBLEM TO BE SOLVED: To provide a modular connector equipped with an EMI protection capable of enhancing effective speed of a data channel, as a connector for high-speed transmission.
SOLUTION: The connector includes a first housing 120 and a second housing that are configured to be coupled together. The connector may include two circuit cards 240, 260 supported by card supports 230. Mating edges of the first housing 120 and the second housing are configured to be coupled together and may be provided with one or more crushed ribs fitted at an elongated channel 128/elongated shoulder interface. The one or more crushed ribs may be configured so as to be spaced apart a distance that acts to improve the electrical shielding provided by the connector. The connector may be configured to be coupled to a cable.
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：提供具有能够提高数据通道的有效速度的EMI保护的模块化连接器作为用于高速传输的连接器。 解决方案：连接器包括被配置为联接在一起的第一壳体120和第二壳体。 连接器可以包括由卡支撑件230支撑的两个电路卡240,260。第一壳体120和第二壳体的配合边缘被构造成联接在一起，并且可以设置有一个或多个被配合在细长通道128 / 伸长的肩部接口。 一个或多个压碎肋可以被构造成间隔开一定距离，用于改善由连接器提供的电屏蔽。 连接器可以被配置为联接到电缆。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2009147349A
公开(公告)日：2009-07-02
申请号：JP2008327793
申请日：2008-12-24
Applicant: Molex Inc , モレックス インコーポレイテドMolex Incorporated
Inventor： REGNIER KENT E , BRUNKER DAVID L , OGBUOKIRI MARTIN U
CPC classification number: H05K1/0245 , H01L2223/6627 , H01L2924/0002 , H01L2924/1903 , H05K1/0222 , H05K1/0251 , H05K1/115 , H05K3/429 , H05K2201/044 , H05K2201/09236 , H05K2201/09609 , H05K2201/09636 , H05K2201/09718 , H05K2201/10189 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a via arrangement and a circuit trace exit structure which are suitable for high speed differential signal transmission. SOLUTION: A via arrangement vias 401 to 404 or a circuit trace 420 exit structure is used. In the via arrangement of vias 401 to 404, vias 401 and 402 of differential signal pairs 420 and associated ground vias 403 and 404 are arranged adjacent to each other in a repeating pattern. The differential signal vias 401 and 402 of each pair are arranged at intervals closer to their associated ground vias than the adjacent differential signal pair associated ground 405a, and differential signal vias 401 and 402 are electrically coupled to their associated ground vias 403 and 404. The circuit trace 420 exit structure involves exit portions of the circuit trace 420 of the differential signal vias 401 and 402 to follow a path where traces then meet with and join to transmission line portions of conductive traces. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供适用于高速差分信号传输的通孔布置和电路走线出口结构。 解决方案：使用通孔布置通孔401至404或电路迹线420出口结构。 在通孔401至404的通孔布置中，差分信号对420和相关联的接地通孔403和404的通孔401和402以重复图案彼此相邻布置。 每对的差分信号通孔401和402以比相邻的差分信号对相关联的接地405a更接近它们相关联的接地通道的间隔被布置，并且差分信号通孔401和402电耦合到它们相关联的接地通孔403和404。 电路迹线420出口结构涉及差分信号通路401和402的电路迹线420的出口部分，以跟随迹线然后与导电迹线的传输线部分相交并连接的路径。 版权所有（C）2009，JPO＆INPIT
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Patent Agency Ranking
公开(公告)号：JP2013211271A
公开(公告)日：2013-10-10
申请号：JP2013098257
申请日：2013-05-08
Applicant: Molex Inc , モレックス インコーポレイテドMolex Incorporated
Inventor： SCOTT D SOMMERS , REGNIER KENT E , KAMARAUSKAS MICHAEL R , EMANUEL G BANAKIS , GALEN F FROMM
IPC: H01R13/6473 , H01R12/75 , H01R13/658
CPC classification number: H05K3/00 , H01R12/57 , H01R12/707 , H01R12/725 , H01R13/658 , H01R23/6873 , Y10T29/49149
Abstract: PROBLEM TO BE SOLVED: To provide a connector which allows high density mounting and is suitable for high frequency signaling.SOLUTION: A board-mountable connector 20 is provided. The connector 20 includes a shield 24 and an insulative housing 22 with a tongue. Terminals (S, G, and D) are supported by the housing 22 in two rows and the rows extend from a mating interface to a board mounting interface. The terminals (S, G, and D) are mounted to the board with surface mount technology in two rows that are at about 0.4 mm pitch. The two rows of terminals (S, G, and D) are configured in a signal, signal, ground triangular configuration so as to provide a triangular terminal arrangement that extends from the mating interface to the mounting interface.
Abstract translation: 要解决的问题：提供一种允许高密度安装并适用于高频信号的连接器。解决方案：提供一种板安装式连接器20。 连接器20包括屏蔽24和具有舌头的绝缘外壳22。 端子（S，G和D）由壳体22支撑成两排，并且排从配合接口延伸到电路板安装接口。 端子（S，G和D）以表面贴装技术安装在板上，两行间距约为0.4mm。 两排端子（S，G和D）被配置成信号，信号，接地三角形配置，以便提供从配合接口延伸到安装接口的三角形端子装置。
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公开(公告)号：JP2013058497A
公开(公告)日：2013-03-28
申请号：JP2012257288
申请日：2012-11-26
Applicant: Molex Inc , モレックス インコーポレイテドMolex Incorporated
Inventor： LANG HAROLD KEITH , REGNIER KENT E , LONG JERRY A
IPC: H01R13/516 , H01R13/658
CPC classification number: H01R24/60 , H01R9/03 , H01R9/038 , H01R13/46 , H01R13/506 , H01R13/508 , H01R13/6275 , H01R13/65802 , H01R13/6584 , H01R13/659 , H01R13/6594 , H01R13/6658 , H01R24/00 , H01R2107/00
Abstract: PROBLEM TO BE SOLVED: To provide a guide frame that can be mounted to a circuit board and includes an opening that can receive a connector therein.SOLUTION: The connector guide comprises: a first column, a second column 305, a bottom cross-piece, and a top cross-piece 307 which form a rectangular guide frame 300; and a first retention member 330 and a second retention member opening 340 which help hold a connector in place. The first retention member and the second retention member opening are configured to couple with engagement members on the connector. The guide frame 300 also includes a flange 312 that extends outward from the top cross-piece 307, and can be used to interact with an opposing plug connector.
Abstract translation: 要解决的问题：提供一种可以安装到电路板上并包括可以在其中容纳连接器的开口的引导框架。 解决方案：连接器引导件包括：形成矩形引导框架300的第一列，第二列305，底部横向件和顶部横向件307; 以及有助于将连接器保持在适当位置的第一保持构件330和第二保持构件开口340。 第一保持构件和第二保持构件开口构造成与连接器上的接合构件联接。 引导框架300还包括从顶部横向件307向外延伸的凸缘312，并且可用于与相对的插头连接器相互作用。 版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JP2013122922A
公开(公告)日：2013-06-20
申请号：JP2013005089
申请日：2013-01-16
Applicant: Molex Inc , モレックス インコーポレイテドMolex Incorporated
Inventor： BRUCE REED , LANG HAROLD KEITH , REGNIER KENT E , JAY NEER
IPC: H01R24/60 , H01R12/72 , H01R13/658
CPC classification number: H01R24/60 , H01R9/03 , H01R9/038 , H01R13/46 , H01R13/506 , H01R13/508 , H01R13/6275 , H01R13/65802 , H01R13/6584 , H01R13/659 , H01R13/6594 , H01R13/6658 , H01R24/00 , H01R2107/00
Abstract: PROBLEM TO BE SOLVED: To provide a connector that facilitates manufacturing while still providing a dense, high-performance connector.SOLUTION: A connector 600 of horizontal construction includes at least a pair of first and second halves that are mated together along a common mating line. A plurality of mating blades 607 are supported in a vertical arrangement within a mating portion of the connector. The connector includes two distinct fastenings means for holding housing halves 610 and 611 together. First fastening means is provided as a horizontal attachment member 612 that extends widthwise in the mating portion in a space between circuit cards 607. Second fastening means is provided as an exterior retainer 620 that engages at least part of the outer circumference, or perimeter of the connector.
Abstract translation: 要解决的问题：提供一种在仍然提供密集的高性能连接器的同时便于制造的连接器。 解决方案：水平结构的连接器600包括至少一对第一和第二半部，其沿共同配合线配合在一起。 多个配合叶片607以垂直方式支撑在连接器的配合部分内。 连接器包括两个不同的紧固装置，用于将壳体半部610和611保持在一起。 第一紧固装置被设置为水平附接构件612，其在电路卡片607之间的空间中的配合部分中宽度方向延伸。第二紧固装置设置为外部保持器620，其与外部保持器620的至少一部分接合， 连接器。 版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JP2013102163A
公开(公告)日：2013-05-23
申请号：JP2012245523
申请日：2012-11-07
Applicant: Molex Inc , モレックス インコーポレイテドMolex Incorporated
Inventor： REGNIER KENT E
IPC: H05K7/20
CPC classification number: H01R13/533 , F28F3/02 , G02B6/4201 , H05K7/20509
Abstract: PROBLEM TO BE SOLVED: To provide a connector system suited to manage thermal loads.SOLUTION: A connector includes a heat spreader. The heat spreader is configured to direct heat from ports to a thermal plate that is disposed apart from the connector. A plurality of such connectors can be supported and the heat spreaders can be linked with each of the connectors. One or more thermal plates can be thermally coupled to the corresponding heat spreaders so as to direct thermal energy away from each connector. Cold blocks can be used to thermally couple the heat spreaders to the corresponding thermal plates.
Abstract translation: 要解决的问题：提供适合于管理热负荷的连接器系统。
解决方案：连接器包括散热器。 散热器构造成将热量从端口引导到与连接器分开设置的热板。 可以支撑多个这样的连接器，并且散热器可以与每个连接器连接。 一个或多个热板可以热耦合到相应的散热器，以便将热能引导离开每个连接器。 冷块可用于将散热器热耦合到相应的热板。 版权所有（C）2013，JPO＆INPIT
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10.发明专利
公开(公告)号：JP2009100003A
公开(公告)日：2009-05-07
申请号：JP2008327816
申请日：2008-12-24
Applicant: Molex Inc , モレックス インコーポレイテドMolex Incorporated
Inventor： REGNIER KENT E , BRUNKER DAVID L , OGBUOKIRI MARTIN U
CPC classification number: H05K1/0245 , H01L2223/6627 , H01L2924/0002 , H01L2924/1903 , H05K1/0222 , H05K1/0251 , H05K1/115 , H05K3/429 , H05K2201/044 , H05K2201/09236 , H05K2201/09609 , H05K2201/09636 , H05K2201/09718 , H05K2201/10189 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a technique for designing a circuit board useful for high-speed differential signal applications. SOLUTION: In a via arrangement, differential signal pair vias and an associated grounding are arranged adjacent to each other in a repeating pattern. The differential signal vias of each pair are spaced at regular intervals closer to their associated grounding vias than the spacing between the adjacent differential signal pair associated grounding so that the differential signal vias exhibit preference for electrical coupling to their associated grounding vias. A circuit trace exit structure includes the exit portions of circuit traces of the differential signal vias to follow a path where the traces then meet with and join to the transmission line portions of the conductive traces. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供一种用于设计用于高速差分信号应用的电路板的技术。 解决方案：在通孔布置中，差分信号对通孔和相关联的接地以重复图案彼此相邻布置。 每对的差分信号通孔以比相邻的差分信号对相关接地之间的间隔更接近它们相关联的接地通孔的规则间隔间隔开，使得差分信号通孔优先于与其相关联的接地通孔的电耦合。 电路走线出口结构包括差分信号通路的电路迹线的出口部分，以跟随路径，其中迹线然后与导电迹线的传输线部分相接并连接。 版权所有（C）2009，JPO＆INPIT
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