Invention Patent
- Patent Title: Thermoconductive adhesive sheet
- Patent Title (中): 热固性粘合片
-
Application No.: JP2013026233Application Date: 2013-02-14
-
Publication No.: JP2013189633APublication Date: 2013-09-26
- Inventor: TOJO MIDORI , TERADA YOSHIO , FURUTA KENJI , NAKAYAMA JUNICHI
- Applicant: Nitto Denko Corp , 日東電工株式会社
- Assignee: Nitto Denko Corp,日東電工株式会社
- Current Assignee: Nitto Denko Corp,日東電工株式会社
- Priority: JP2012029628 2012-02-14
- Main IPC: C09J7/02
- IPC: C09J7/02 ; C09J201/00 ; H01L23/36
Abstract:
PROBLEM TO BE SOLVED: To provide a thermoconductive adhesive sheet that is superior in thermal conductivity, and capable of reducing an amount of organic compound gas generated when heated to a high temperature.SOLUTION: A thermoconductive adhesive sheet is characterized in that an amount of organic compound gas generated by heating for 30 minutes at a temperature of 150°C does not exceed 50μg/cm2, and the thermal resistance after being stored for 30 minutes at 25°C does not exceed 10 cmK/W.
Information query
