Invention Patent
- Patent Title: Thermally conductive adhesive composition
- Patent Title (中): 导热粘合剂
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Application No.: JP2012139764Application Date: 2012-06-21
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Publication No.: JP2014005320APublication Date: 2014-01-16
- Inventor: FURUTA KENJI , TERADA YOSHIO , IGUCHI SHINJI
- Applicant: Nitto Denko Corp , 日東電工株式会社
- Assignee: Nitto Denko Corp,日東電工株式会社
- Current Assignee: Nitto Denko Corp,日東電工株式会社
- Priority: JP2012139764 2012-06-21
- Main IPC: C09J201/00
- IPC: C09J201/00 ; C09J7/00 ; C09J9/00 ; C09J11/04
Abstract:
PROBLEM TO BE SOLVED: To provide a thermally conductive adhesive composition in which shear displacement is reduced while thermal conductivity is excellent.SOLUTION: A thermally conductive adhesive composition contains: an adhesive component that contains high polymers and low polymers; and thermally conductive particles. The gel fraction in the adhesive component is 28%-59% by mass, and the thermal conductivity is at least 0.3 W/m K.
Public/Granted literature
- JP5921970B2 熱伝導性粘着組成物 Public/Granted day:2016-05-24
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