发明专利
- 专利标题: Support body, method for manufacturing the same, method for manufacturing wiring board, method for manufacturing electronic component device, and wiring structure
- 专利标题(中): 支撑体,其制造方法,制造接线板的方法,制造电子元件装置的方法和接线结构
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申请号: JP2012162005申请日: 2012-07-20
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公开(公告)号: JP2014022665A公开(公告)日: 2014-02-03
- 发明人: KOBAYASHI KAZUHIRO
- 申请人: Shinko Electric Ind Co Ltd , 新光電気工業株式会社
- 专利权人: Shinko Electric Ind Co Ltd,新光電気工業株式会社
- 当前专利权人: Shinko Electric Ind Co Ltd,新光電気工業株式会社
- 优先权: JP2012162005 2012-07-20
- 主分类号: H05K3/46
- IPC分类号: H05K3/46 ; H01L23/12
摘要:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a support body having a structure in which a support substrate and metal foil can be easily separated and the like.SOLUTION: A method for manufacturing a support body includes the steps of: arranging an adhesive force adjustment layer for adjusting a contact area of a support substrate and a peeling layer in a predetermined region excluding an outer peripheral part on the support substrate; and arranging metal foil in which the peeling layer is formed on one surface thereof on the adhesive force adjustment layer and the outer peripheral part of the support substrate in the state in which the peeling layer is oriented to the side of the support substrate, and temporarily bonding the outer peripheral part of the support substrate and the peeling layer in a peelable manner. In the step of temporary bonding, the support substrate and the adhesive force adjustment layer are bonded, and the peeling layer and the adhesive force adjustment layer contact with each other without bonding.
公开/授权文献
- JP6054080B2 支持体及びその製造方法、配線基板の製造方法、電子部品装置の製造方法、配線構造体 公开/授权日:2016-12-27
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