PROBLEM TO BE SOLVED: To provide an excellent copper alloy material having excellent mechanical strength property, electric conductivity and thermal safety as a material for information transmission and electric contact such as a semiconductor lead frame, other consumer electronics and an automobile connector, while containing a part of impurity components inside, and to provide its manufacturing method.SOLUTION: A copper alloy material contains 0.5 to 4.0 wt.% of Ni, 0.1 to 1.0 wt.% of Si, 0.02 to 0.2 wt.% of P and the balance Cu with inevitable impurities which are one or more transition metals selected by a group consisting of Ti, Co, Fe, Mn, Cr, Nb, V, Zr and Hf, and the transition metals constitutes a compound having a form of Ni-Si-P-X, where X is the transition metal.