Copper alloy material for electric and electronic component and its manufacturing method
    3.
    发明专利
    Copper alloy material for electric and electronic component and its manufacturing method 审中-公开
    电力电子元器件铜合金材料及其制造方法

    公开(公告)号:JP2014095151A

    公开(公告)日:2014-05-22

    申请号:JP2013231935

    申请日:2013-11-08

    CPC classification number: C22F1/08 C22C9/06 C22C9/10 C22C30/02 H01B1/026

    Abstract: PROBLEM TO BE SOLVED: To provide an excellent copper alloy material having excellent mechanical strength property, electric conductivity and thermal safety as a material for information transmission and electric contact such as a semiconductor lead frame, other consumer electronics and an automobile connector, while containing a part of impurity components inside, and to provide its manufacturing method.SOLUTION: A copper alloy material contains 0.5 to 4.0 wt.% of Ni, 0.1 to 1.0 wt.% of Si, 0.02 to 0.2 wt.% of P and the balance Cu with inevitable impurities which are one or more transition metals selected by a group consisting of Ti, Co, Fe, Mn, Cr, Nb, V, Zr and Hf, and the transition metals constitutes a compound having a form of Ni-Si-P-X, where X is the transition metal.

    Abstract translation: 要解决的问题:提供具有优异的机械强度性能,导电性和热安全性的优良铜合金材料,作为用于信息传输和电接触的材料,例如半导体引线框架,其他消费电子产品和汽车连接器,同时包含 部分杂质成分在其内部,并提供其制造方法。解决方案:铜合金材料含有0.5〜4.0重量%的Ni,0.1〜1.0重量%的Si,0.02〜0.2重量%的P,余量为Cu 其中不可避免的杂质是由Ti,Co,Fe,Mn,Cr,Nb,V,Zr和Hf组成的组中选择的一种或多种过渡金属,过渡金属构成具有Ni-Si-PX形式的化合物 ,其中X是过渡金属。

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