微电子组件200包括电路板154，第一微电子封装100A和连接到电路板的相应的第一表面150和第二表面152的第二微电子封装100B 它可以提供。 每个包100可包括微电子元件101，具有第一表面108和第二表面110的衬底102，和设置在所述第二表面处暴露的端子104。 终端104，多个第一端子包括第一第一组114和第二组分别位于在侧的第二侧上的第一端子124和理论轴线132的反向 它可以有。 第一终端104可以由所有可寻址存储器位置的可用地址电路中使用封装100，以确定从微电子元件101的存储器存储阵列的可寻址的存储器位置的一个 它可以被配置成携带地址信息。 在第一组114中的第一端子104的信号的分配，可在第二组124中的第一终端的信号分配的镜像。 点域8A

Microelectronic assembly 200 includes a circuit panel 154, a first microelectronic package 100A and the second microelectronic package 100B attached to the respective first surface 150 and second surface 152 of the circuit panel it can be equipped with. Each package 100 may include a microelectronic element 101, a substrate 102 having a first surface 108 and second surface 110, and a terminal 104 which is exposed at the second surface. Terminal 104 includes a plurality of first terminals comprising a first first set 114 and second set 124 of the first terminal disposed on the respective second sides of the side and the reverse of the theoretical axis 132 it can have. The first terminal 104 can be used by all of the available address circuit of addressable memory locations package 100 to determine one of the addressable memory location from the memory storage array of microelectronic element 101 it can be configured to carry an address information. Signal allocation of the first terminal 104 in the first set 114 can be a mirror image of the signal assignment of a first terminal in the second set 124.
.FIELD 8A