用于制造电气部件（100）步过程是要应用和提供衬底（104），在所述基板上施加绝缘层（110）的步骤，在绝缘层上的电路层（112） 时，并照射电子束，以改变所述绝缘层，所述电路层，以改变所述电路层照射在绝缘层上的电子束（114）的步骤。 该衬底可以是具有高热导率的金属基片。 绝缘层，用于电分离，基板和电路层之间的有效的热传递。 该方法可以包括耦合的发光二极管模块（102）或其他有源电路需要热管理存在具有电绝缘性和热传导性的层上的电路层的工序。

Step process for producing the electric component (100) is to be applied and providing a substrate (104), a step of applying an insulating layer (110) on the substrate, the circuit layer on the insulating layer (112) When, and a step of irradiating an electron beam irradiating an electron beam (114) in the insulating layer in order to change the insulating layer, the circuit layer in order to change the circuit layer. The substrate may be a metal substrate having high thermal conductivity. The insulating layer may provide electrical isolation and efficient heat transfer between the substrate and the circuit layer. The method may include the step of coupling the light emitting diode module (102) or other active circuit requiring thermal management to the circuit layer present on the layer having electrical insulation and thermal conductivity.