结构10可包括具有在所述第一表面的所述第一部分的贴合基到导电元件18和从基板12远离定位的端部表面上的键合元件24。 电介质密封元件40具有从与所述第一部分的顶部的第一部分的扩散，并填充接合元件24之间的空间，以粘合的元件24分隔到彼此。 密封元件40具有位于远离第一表面的第三表面。 没有键合元件24密封部，所述第三表面由未包括在密封元件的端部表面的至少一部分限定。 密封元件40限定至少部分所述第一表面的第二部分210。 所述第二部分比所述第一部分之外的部分，仅具有尺寸的区域，以容纳所述微电子元件602的整个区域。 一些导电元件18的处于第二部分被构造成连接这种微电子元件602。 点域

Structure 10 may include a bonded element 24 having a bonded base in conductive element 18 in the first portion of the first surface and an end surface positioned away from the substrate 12. The dielectric sealing element 40 has a spread from the first portion together with the top of the first portion, which fills the space between the bonded element 24 to separate the bond element 24 to each other. Sealing element 40 has a third surface located away from the first surface. Sealed portions not of the bond element 24, the third surface is defined by at least a portion of the end surface not covered by the sealing element. Sealing element 40 defines a second portion 210 of the first surface at least partially. The second portion is a portion other than the first portion, and has an area of ​​only size to accommodate the entire area of ​​the microelectronic element 602. Several conductive element 18 is in the second portion is configured to connect such a microelectronic element 602.
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