To provide a surface grinding method of wafer capable of grinding both surfaces of the wafer while preventing cracking of the wafer and residual of resin on an edge part.SOLUTION: A surface grinding method includes a step of preparing wafer which has a first principal plane and a second principal plane of the side opposite to the first principal plane, and contains an edge part located between the first principal plane and the second principal plane, a step of applying the releasing agent onto a part of the second principal plane and the edge part of the wafer to form a releasing agent layer, a step of forming a resin layer which covers the whole surface of the second principal plane and the edge part on the releasing agent layer, a step of arranging a base member onto the resin layer to provide a wafer composite, a step of grinding the first principal plane of the wafer while supporting and fixing the wafer composite on a position of the base member, a step of removing the base member from the wafer composite, a step of grinding the second principal plane of the wafer while supporting and fixing the wafer on a position of the first principal plane and a step of washing the wafer to remove the releasing agent layer and the resin layer remaining on the edge part of the wafer.SELECTED DRAWING: Figure 1