Invention Patent
- Patent Title: Method of manufacturing a resin-sealed type semiconductor device
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Application No.: JP24752099Application Date: 1999-09-01
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Publication No.: JP4362902B2Publication Date: 2009-11-11
- Inventor: 勝喜 内海 , 匡紀 南尾 , 隆広 松尾 , 邦和 竹村
- Applicant: パナソニック株式会社
- Assignee: パナソニック株式会社
- Current Assignee: パナソニック株式会社
- Priority: JP24752099 1999-09-01
- Main IPC: H01L21/50
- IPC: H01L21/50 ; H01L23/50
Public/Granted literature
- JP2001077129A MANUFACTURE OF RESIN-SEALED SEMICONDUCTOR DEVICE Public/Granted day:2001-03-23
Information query
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