Invention Patent
- Patent Title: Method of manufacturing a bus bar wiring layer
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Application No.: JP2005199633Application Date: 2005-07-08
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Publication No.: JP4696735B2Publication Date: 2011-06-08
- Inventor: 秀紀 後藤
- Applicant: 住友電装株式会社
- Assignee: 住友電装株式会社
- Current Assignee: 住友電装株式会社
- Priority: JP2005199633 2005-07-08
- Main IPC: H01R43/16
- IPC: H01R43/16 ; H01R4/58 ; H02G3/16
Public/Granted literature
- JP2007018899A Manufacturing method of bus bar wiring layer, and coupling bus bar Public/Granted day:2007-01-25
Information query
