Invention Patent
- Patent Title: Interconnection substrate
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Application No.: JP2005192369Application Date: 2005-06-30
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Publication No.: JP4770295B2Publication Date: 2011-09-14
- Inventor: 智幸 久保
- Applicant: ブラザー工業株式会社
- Assignee: ブラザー工業株式会社
- Current Assignee: ブラザー工業株式会社
- Priority: JP2005192369 2005-06-30
- Main IPC: H05K1/02
- IPC: H05K1/02
Public/Granted literature
- JP2007012900A Wiring board Public/Granted day:2007-01-18
Information query
