Invention Patent
- Patent Title: Laser assembly of the laser bonding method and resin member of the resin member
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Application No.: JP2010270428Application Date: 2010-12-03
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Publication No.: JP5555613B2Publication Date: 2014-07-23
- Inventor: 直之 松尾 , 麻由 下田 , 龍太 木部
- Applicant: 日東電工株式会社
- Assignee: 日東電工株式会社
- Current Assignee: 日東電工株式会社
- Priority: JP2010023456 2010-02-04
- Main IPC: B29C65/16
- IPC: B29C65/16
Public/Granted literature
- JP2011178156A Laser joining method of resin member, and laser joined body of resin member Public/Granted day:2011-09-15
Information query
